Aaron Matthew Martin

US Patent:

20130313709, Nov 28, 2013

Filed:

Dec 22, 2011

Appl. No.:

13/994919

Inventors:

Todd A. Hinck - Arlington MA, US
Zuoguo Wu - San Jose CA, US
Aaron Martin - El Dorado Hills CA, US
Andrew W. Martwick - Portland OR, US
John B. Halbert - Beaverton OR, US

International Classification:

H01L 25/065

US Classification:

257738, 257786

Abstract:

Apparatuses for interconnecting integrated circuit dies. A first set of single-ended transmitter circuits are included on a first die. The transmitter circuits are impedance matched and have no equalization. A first set of single-ended receiver circuits are included on a second die. The receiver circuits have no termination and no equalization. Conductive lines are coupled between the first set of transmitter circuits and the first set of receiver circuits. The lengths of the conductive lines are matched. The first die, the first set of single-ended transmitter circuits, the second die, the first set of single ended receiver circuits and the conductive lines are disposed within a first package. A second set of single-ended transmitter circuits are included on the first die. The transmitter circuits are impedance matched and have no equalization. Data transmitted from the second set of transmitter circuits is transmitted according to a data bus inversion (DBI) scheme. A second set of single-ended receiver circuits is included on a third die. The receiver circuits have termination. Conductive lines are coupled between the second set of transmitter circuits and the second set of receiver circuits. The lengths of the conductive lines are matched and the second set of receiver circuits is disposed within a second package.