Abhay K Bhushan from 3838 Mumford Pl, Palo Alto, CA 94306, Phone: 6504248110

Abhay Bhushan

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Location:

3838 Mumford Pl, Palo Alto, CA 94306

Industry:

Public Policy

Work:

IIT Kanpur since Jan 2010
President, IIT Kanpur Foundation
IIT Kanpur Alumni Association Mar 2008 - Mar 2010
President
PanIIT Jun 2003 - Jan 2006
President

Education:

Massachusetts Institute of Technology 1965 - 1971
SM, EE, Management Indian Institute of Technology, Kanpur 1960 - 1965
B Tech, Electrical Engineering

Abhay Bhushan

About:

Born:

1944

Work:

Position:

Chairman • Author • President

Education:

Studied at:

Massachusetts Institute of Technology • Indian Institute of Technology Kanpur • MIT Sloan School of Management

Area of science:

Architecture

Skills & Activities:

Master status:

Student

Skill:

File Transfer Protocol

Abhay Bhushan

Us Patents

Ultra-Low Particle Semiconductor Cleaner
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US Patent:

6352082, Mar 5, 2002
Filed:

Sep 21, 1998
Appl. No.:

09/157765
Inventors:

Raj Mohindra - Los Altos Hills CA
Abhay Bhushan - Palo Alto CA
Rajiv Bhushan - Mountain View CA
Suraj Puri - Los Altos CA
John H. Anderson Sr. - Milpitas CA
Jeffrey Nowell - San Francisco CA
Assignee:

SCD Mountain View - Chaska MN
International Classification:

B08B 304
US Classification:

134 254, 134 26, 134 34
Abstract:

A method ( ) for cleaning a semiconductor wafer. The method includes immersing ( ) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step ( ) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Ultra-Low Particle Semiconductor Cleaner
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US Patent:

6491043, Dec 10, 2002
Filed:

Dec 11, 2001
Appl. No.:

10/014113
Inventors:

Raj Mohindra - Los Altos CA
Abhay Bhushan - Palo Alto CA
Rajiv Bhushan - Mountain View CA
Suraj Puri - Los Altos CA
Jeffrey Nowell - San Francisco CA
Assignee:

SCD Mountain View, Inc. - Chaska MN
International Classification:

B08B 304
US Classification:

134 254, 134 2, 134 3, 134 21, 134 26, 134 28, 134 31, 134 34, 134902
Abstract:

A method ( ) for cleaning a semiconductor wafer. The method includes immersing ( ) a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step ( ) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Apparatus For Delivering Ultra-Low Particle Counts In Semiconductor Manufacturing
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US Patent:

63125978, Nov 6, 2001
Filed:

Dec 1, 1995
Appl. No.:

8/568595
Inventors:

Raj Mohindra - Los Altos Hills CA
Abhay K. Bhushan - Palo Alto CA
Rajiv Bhushan - Palo Alto CA
Suraj Puri - Los Altos CA
Assignee:

SCD Mountain View, Inc. - Chaska MN
International Classification:

B08B 310
US Classification:

210243
Abstract:

The invention relates to a wafer rinsing system for rinsing chemicals and particles off of wafers without introducing contaminants. The system reduces the particle count on wafers by filtering the water and the gas used during rinsing at the wet bench. The system includes a rinsing unit, a local water filter bank, a local gas filtering system, an H. sub. 2 O. sub. 2 injection unit, an auxiliary chemical injection unit, and a controller for operating the other components. The water filter bank provides a multiple stage filtering system to eliminate particles without a substantial drop in water pressure. The H. sub. 2 O. sub. 2 injection unit provides a local source of H. sub. 2 O. sub. 2 to clean the filter and rinser and to provide a mechanism for controlling the formation of native oxide on the wafer during rinsing. The auxiliary chemical injection unit provides a chemical additive to the rinsing unit to enhance the wafer cleaning process.

Ultra-Low Particle Semiconductor Apparatus
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US Patent:

56853270, Nov 11, 1997
Filed:

Aug 8, 1996
Appl. No.:

8/695285
Inventors:

Raj Mohindra - Los Altos Hills CA
Abhay Bhushan - Palo Alto CA
Rajiv Bhushan - Mountain View CA
Suraj Puri - Los Altos CA
John H. Anderson - Milpitas CA
Jeffrey Nowell - San Francisco CA
Assignee:

YieldUP International - Mountainview CA
International Classification:

B08B 304
US Classification:

134 952
Abstract:

Apparatus for cleaning and drying a semiconductor wafer. The apparatus includes a vessel adapted to immerse a partially completed semiconductor wafer in a liquid comprising water. The apparatus also includes a control valve operably coupled to the vessel through a drain, and adapted to allow a gaseous mixture to displace the liquid in the vessel, where the liquid is displaced adjacent to the front face of the partially completed wafer. A controller is included. The controller is operably coupled to a plurality of nozzles. The controller can be used to pulse a drying fluid from the plurality of nozzles to the partially completed wafer to remove a possibility of liquid which may be attached to the partially completed wafer.

Ultra-Low Particle Semiconductor Cleaner Using Heated Fluids
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US Patent:

59581468, Sep 28, 1999
Filed:

Sep 24, 1998
Appl. No.:

9/160505
Inventors:

Raj Mohindra - Los Altos CA
Abhay Bhushan - Palo Alto CA
Rajiv Bhushan - Mountain View CA
Suraj Puri - Los Altos CA
David Wong - Los Gatos CA
Assignee:

YieldUP International - Mountain View CA
International Classification:

B08B 304
B08B 310
B08B 500
US Classification:

134 2
Abstract:

A method (400) for cleaning a semiconductor wafer. The method includes immersing (420) a wafer in a hot or heated liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step (450) also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

Apparatus For Delivering Ultra-Low Particle Counts In Semiconductor Manufacturing
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US Patent:

55424414, Aug 6, 1996
Filed:

Aug 3, 1994
Appl. No.:

8/285316
Inventors:

Raj Mohindra - Los Altos Hills CA
Abhay K. Bhushan - Palo Alto CA
Rajiv Bhushan - Palo Alto CA
Suraj Puri - Los Altos CA
Assignee:

YieldUP International - Mountain View CA
International Classification:

B08B 304
US Classification:

134 952
Abstract:

The invention relates to a wafer rinsing system for rinsing chemicals and particles off of wafers without introducing contaminants. The system reduces the particle count on wafers by filtering the water and the gas used during rinsing at the wet bench. The system includes a rinsing unit, a local water filter bank, a local gas filtering system, an H. sub. 2 O. sub. 2 injection unit, an auxiliary chemical injection unit, and a controller for operating the other components. The water filter bank provides a multiple stage filtering system to eliminate particles without a substantial drop in water pressure. The H. sub. 2 O. sub. 2 injection unit provides a local source of H. sub. 2 O. sub. 2 to clean the filter and rinser and to provide a mechanism for controlling the formation of native oxide on the wafer during rinsing. The auxiliary chemical injection unit provides a chemical additive to the rinsing unit to enhance the wafer cleaning process.

Method And Apparatus For Delivering Ultra-Low Particle Counts In Semiconductor Manufacturing
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US Patent:

56513798, Jul 29, 1997
Filed:

Dec 1, 1995
Appl. No.:

8/566302
Inventors:

Raj Mohindra - Los Altos Hills CA
Abhay K. Bhushan - Palo Alto CA
Rajiv Bhushan - Palo Alto CA
Suraj Puri - Los Altos CA
Assignee:

YieldUP International - Mountain View CA
International Classification:

B08B 304
US Classification:

134 952
Abstract:

The invention relates to a wafer rinsing system for rinsing chemicals and particles off of wafers without introducing contaminants. The system reduces the particle count on wafers by filtering the water and the gas used during rinsing at the wet bench. The system includes a rinsing unit, a local water filter bank, a local gas filtering system, an H. sub. 2 O. sub. 2 injection unit, an auxiliary chemical injection unit, and a controller for operating the other components. The water filter bank provides a multiple stage filtering system to eliminate particles without a substantial drop in water pressure. The H. sub. 2 O. sub. 2 injection unit provides a local source of H. sub. 2 O. sub. 2 to clean the filter and rinser and to provide a mechanism for controlling the formation of native oxide on the wafer during rinsing. The auxiliary chemical injection unit provides a chemical additive to the rinsing unit to enhance the wafer cleaning process.

Ultra-Low Particle Semiconductor Cleaner
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US Patent:

61584460, Dec 12, 2000
Filed:

Sep 4, 1998
Appl. No.:

9/148641
Inventors:

Raj Mohindra - Los Altos CA
Abhay Bhushan - Palo Alto CA
Rajiv Bhushan - Mountain View CA
Suraj Puri - Los Altos CA
John H. Anderson - Milpitas CA
Jeffrey Nowell - San Francisco CA
Assignee:

FSI International - Chaska MN
International Classification:

B08B 920
US Classification:

134 254
Abstract:

A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.