Abstract:
An all-additive apparatus for direct fabrication of nanometer-scale planar and multilayer structures that performs “pick-and-place” retrieval and deposition of materials comprises a tip and a controller and transport mechanism configured for causing the tip to acquire a transferable material and deposit at least a portion of the acquired transferable material at a predetermined location onto a substrate, without the use of a bridging medium, in order to directly assemble a structure. The tip may be submillimeter-scale, may comprise a plurality of sub-tips disposed in a predetermined arrangement, and/or may mechanically vibrate. Mechanical vibration of the tip may be monitored. The tip may acquire the transferable material from a reservoir. The assembled structure may be cured on the substrate.