Akhilesh P Rallabandi

US Patent:

20210329811, Oct 21, 2021

Filed:

Jun 25, 2021

Appl. No.:

17/359134

Inventors:

- Santa Clara CA, US
Akhilesh Rallabandi - Chandler AZ, US
Ellann Cohen - Hillsboro OR, US
Michael Nakanishi - Happy Valley OR, US
John Carver - Portland OR, US
Arturo Navarro Alvarez - Belen, CR
Oleg Krishcko - Portland OR, US

International Classification:

H05K 7/20

Abstract:

Sub-ambient cooling systems with condensation mitigation for use with electronic devices are disclosed. An example sub-ambient cooling assembly disclosed herein includes a heat spreader to remove heat from an electronic component. A thermal electric cooler that is to remove heat from the heat spreader. A heat exchanger to remove heat from the thermal electric cooler, where the thermal electric cooler is positioned between the heat spreader and the heat exchanger. A shroud is to at least partially surround the heat spreader and the thermal electric cooler, where the heat exchanger is to transfer heat to the shroud to increase a surface temperature of the shroud.

US Patent:

20210249375, Aug 12, 2021

Filed:

Feb 7, 2020

Appl. No.:

16/785014

Inventors:

- Santa Clara CA, US
Joe Walczyk - Tigard OR, US
Weihua Tang - Chandler AZ, US
Akhilesh Rallabandi - Chandler AZ, US
Marco Aurelio Cartas Ayala - Chandler AZ, US

Assignee:

INTEL CORPORATION - Santa Clara CA

International Classification:

H01L 23/00

Abstract:

An integrated circuit (IC) die structure comprises a substrate material comprising silicon. Integrated circuitry is over a first side of the substrate material. A composite layer is in direct contact with a second side of the substrate material. The second side is opposite the first side. The composite layer comprises a first constituent material associated with a first linear coefficient of thermal expansion (CTE), and a first thermal conductivity exceeding that of the substrate. The composite layer also comprises a second constituent material associated with a second CTE that is lower than the first, and a second thermal conductivity exceeding that of the substrate.

US Patent:

20210059073, Feb 25, 2021

Filed:

Nov 5, 2020

Appl. No.:

17/090624

Inventors:

- Santa Clara CA, US
Ruander Cardenas - Portland OR, US
Mark MacDonald - Beaverton OR, US
Akhilesh P. Rallabandi - Portland OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 7/20

Abstract:

Heterogeneous heat pipe solutions provide both low thermal resistance and a high Q. Some heterogeneous heat pipe solutions comprise multiple homogenous heat pipes operating in parallel, with each homogeneous heat pipe having its thermal performance tailored to handle a processor operating in a particular power mode. Other heterogeneous heat pipe solutions comprise one or more heterogeneous heat pipes, each heterogeneous heat pipe having more than wick, each wick having a different set of wick characteristics (wick material, wick thickness, etc.). Heterogeneous heat pipes can provide a thermal management solution for processors over their full operating power range.

US Patent:

20200363104, Nov 19, 2020

Filed:

Jul 31, 2020

Appl. No.:

16/945181

Inventors:

- Santa Clara CA, US
Akhilesh P. Rallabandi - Portland OR, US
Genevieve L. Gaudin - Corvallis OR, US
Daniel J. Ragland - Sherwood OR, US
Rodny Rodriguez - Beaverton OR, US
Felipe Gonzalez - Folsom CA, US
Hui Xiong - Portland OR, US
Sai Goutham Ponnada - Folsom CA, US
Christoph Jechlitschek - Hillsboro OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

F25B 21/02
G06F 1/20

Abstract:

In one embodiment, a computing device includes a processor, a water block, a thermoelectric cooler, and a thermal space transformer. The thermoelectric cooler is disposed in series between the processor and the water block, and the thermoelectric cooler includes a heated surface and a cooled surface. The heated surface is thermally coupled to the water block, and the cooled surface is thermally coupled to the processor via the thermal space transformer. The thermal space transformer transfers thermal energy between the processor and the cooled surface of the thermoelectric cooler. The thermal space transformer includes a smaller surface and a larger surface. The smaller surface is thermally coupled to the processor and the larger surface is thermally coupled to the cooled surface of the thermoelectric cooler.

US Patent:

20200326994, Oct 15, 2020

Filed:

Jun 26, 2020

Appl. No.:

16/914177

Inventors:

- Santa Clara CA, US
Bo Qiu - Hillsboro OR, US
Columbia Mishra - Beaverton OR, US
Arijit Chattopadhyay - Folsom CA, US
Chee Lim Nge - Beaverton OR, US
Srikanth Potluri - Folsom CA, US
Jianfang Zhu - Hillsboro OR, US
Deepak Samuel Kirubakaran - Hillsboro OR, US
Akhilesh Rallabandi - Chandler AZ, US
Mark Gallina - Hillsboro OR, US
Renji Thomas - 97123 OR, US
James Hermerding II - Vancouver WA, US

International Classification:

G06F 9/50
G06F 9/48
G06F 11/30

Abstract:

Methods, apparatus, and systems to dynamically schedule a workload to among compute blocks based on temperature are disclosed. An apparatus to schedule a workload to at least one of a plurality of compute blocks based on temperature includes a prediction engine to determine (i) a first predicted temperature of a first compute block of the plurality of compute blocks and (ii) a second predicted temperature of a second compute block of the plurality of compute blocks. The apparatus also includes a selector to select between the first compute block and the second compute block for assignment of the workload. The selection is based on which of the first and second predicted temperatures is lower. The apparatus further includes a workload scheduler to assign the workload to the selected one of the first or second compute blocks.

US Patent:

20190252286, Aug 15, 2019

Filed:

Mar 29, 2019

Appl. No.:

16/370621

Inventors:

- Santa Clara CA, US
Carin Lundquist Ruiz - Portland OR, US
Akhilesh P. Rallabandi - Portland OR, US

Assignee:

INTEL CORPORATION - Santa Clara CA

International Classification:

H01L 23/367
H01L 23/40

Abstract:

Particular embodiments described herein provide for an electronic device that can be configured to enable a segmented heatsink. The electronic device can include a printed circuit board, a substrate, where the substrate is over the printed circuit board, at least two heat sources over the substrate, and a segmented heatsink secured to the printed circuit board, where the segmented heatsink has at least two independent heatsink segments, where each heatsink segment corresponds to at least one heat source and is configured to draw heat from the corresponding heat source. In an example, the heat sources are at a different height.

US Patent:

20180156863, Jun 7, 2018

Filed:

Dec 2, 2016

Appl. No.:

15/367415

Inventors:

- Santa Clara CA, US
James R. Hastings - Chandler AZ, US
Akhilesh P. Rallabandi - Gilbert AZ, US
Morten S. Jensen - Messa AZ, US
Christopher Wade Ackerman - Phoenix AZ, US
Christopher R. Schroeder - Gilbert AZ, US
Nader N. Abazarnia - Chandler AZ, US
John C. Johnson - Phoenix AZ, US

International Classification:

G01R 31/28
H05B 6/10

Abstract:

Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.