Akiko Tanabe

US Patent:

7989313, Aug 2, 2011

Filed:

Apr 16, 2008

Appl. No.:

12/104156

Inventors:

Haochuan Wang - South Pasadena CA, US
Ali Mehrabi - Glendale CA, US
Kouroche Kian - Altadena CA, US
Dave N. Edwards - La Canada CA, US
Akiko Tanabe - Los Angeles CA, US
Mark Licon - Diamond Bar CA, US
Jay Akhave - Claremont CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01L 21/46
H01L 21/30
H01L 21/78
H01L 21/82
H01L 23/544
H01L 21/768

US Classification:

438458, 438460, 438462, 438464, 438128, 257620, 257E21596, 257E21599

Abstract:

A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

US Patent:

7364983, Apr 29, 2008

Filed:

May 4, 2005

Appl. No.:

11/122539

Inventors:

Haochuan Wang - South Pasadena CA, US
Ali Mehrabi - Glendale CA, US
Kouroche Kian - Altadena CA, US
Dave N. Edwards - La Canada CA, US
Akiko Tanabe - Los Angeles CA, US
Mark Licon - Diamond Bar CA, US
Jay Akhave - Claremont CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01L 21/46
H01L 21/30
H01L 21/78
H01L 21/82
H01L 23/544
H01L 21/768

US Classification:

438458, 438460, 438462, 438464, 438128, 257620, 257E21596, 257E21599

Abstract:

A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.