Alan B Tate

US Patent:

7050302, May 23, 2006

Filed:

Apr 29, 2004

Appl. No.:

10/836442

Inventors:

David J. Llapitan - Puyallup WA, US
Alan W. Tate - Puyallup WA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 7/20

US Classification:

361704, 361709, 361719, 257718, 257719, 257727, 165 803, 165185, 174 161, 174 163

Abstract:

Illustrative embodiments of the present invention include, but are not limited to, a heat sink equipped with a captive socket actuating device designed to facilitate engagement and disengagement of the apparatus to and from an integrated circuit (IC) socket.

US Patent:

7277282, Oct 2, 2007

Filed:

Dec 27, 2004

Appl. No.:

11/022903

Inventors:

Alan Tate - Puyallup WA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 7/20
F28F 7/00
F28D 15/00
H01L 23/34
H01B 7/42

US Classification:

361697, 361703, 361704, 361718, 165 803, 16510421, 257713, 174 152

Abstract:

An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes. Each heat pipe has a first end and a second end. The first ends of the heat pipes are thermally coupled to the IC package, and the second ends of the heat pipes are thermally coupled to the base of the heat sink to transfer heat from the IC package to the heat sink.

US Patent:

20180063998, Mar 1, 2018

Filed:

Sep 1, 2016

Appl. No.:

15/254535

Inventors:

- Santa Clara CA, US
ALAN W. TATE - Puyallup WA, US
RALPH W. JENSEN - Steilacoom WA, US

International Classification:

H05K 7/20
G06F 1/20

Abstract:

Embodiments herein relate to liquid cooling interfaces for computer memory components. An apparatus for cooling a computer memory component may include a support and a cooling tube coupled with the support, where the cooling tube is to be positioned parallel to a computer memory connector to receive the computer memory component, and the cooling tube is to be removably coupled with a memory component heat spreader associated with the computer memory component. In some embodiments, the support may be a liquid manifold. Other embodiments may be described and/or claimed.

US Patent:

20140368983, Dec 18, 2014

Filed:

Nov 3, 2011

Appl. No.:

13/976017

Inventors:

Chengxue Zhao - Shanghai, CN
Ming Zhang - Shanghai, CN
Congtao Jiang - Shanghai, CN
Alan Tate - Puyallup WA, US

International Classification:

G06F 1/16

US Classification:

36167909

Abstract:

In various embodiments, a transparent hinged substrate apparatus integrated nto a portable computer may address common deficiencies associated with space limitations on student desktop surfaces. The transparent hinged substrate apparatus may utilize, in some embodiments, a transparent substrate that is positioned between the display side and the keypad side of a portable computer. The transparent hinged substrate apparatus may be movable into multiple positions including one position that covers the keypad side of the portable computer without touching any of the keys of the keypad. Thus, the keypad surface may now be used as a work surface using the same physical space occupied by the portable computer.