Illustrative embodiments of the present invention include, but are not limited to, a heat sink equipped with a captive socket actuating device designed to facilitate engagement and disengagement of the apparatus to and from an integrated circuit (IC) socket.
Integrated Circuit Cooling System Including Heat Pipes And External Heat Sink
An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes. Each heat pipe has a first end and a second end. The first ends of the heat pipes are thermally coupled to the IC package, and the second ends of the heat pipes are thermally coupled to the base of the heat sink to transfer heat from the IC package to the heat sink.
David Llapitan - Tacoma WA, US Michael Berktold - DuPont WA, US Alan Tate - Puyallup WA, US
International Classification:
H05K 7/20
US Classification:
361700000, 165080400
Abstract:
In some embodiments, a multi-processor system board has at least a first processor installed on the system board and at least a first liquid cooling system configured to provide dedicated cooling for the first processor. A second processor may be installed on the system board and a second liquid cooling system may be configured to provide dedicated cooling for the second processor. In some examples, a liquid cooling system includes a tank, a first heat exchanger attached to a first side of the tank, and a second heat exchanger attached to a second side of the tank opposite to the first side of the tank. Other embodiments are disclosed and claimed.
RUSSELL S. AOKI - Tacoma WA, US DEVDATTA P. KULKARNI - University Place WA, US ALAN W. TATE - Puyallup WA, US ROBIN A. STEINBRECHER - Olympia WA, US RALPH W. JENSEN - Hillsboro OR, US
International Classification:
G06F 1/20 F28F 9/26 H05K 1/18 H05K 1/02 H05K 7/20
Abstract:
Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.
- Santa Clara CA, US ALAN W. TATE - Puyallup WA, US RALPH W. JENSEN - Steilacoom WA, US
International Classification:
H05K 7/20 G06F 1/20
Abstract:
Embodiments herein relate to liquid cooling interfaces for computer memory components. An apparatus for cooling a computer memory component may include a support and a cooling tube coupled with the support, where the cooling tube is to be positioned parallel to a computer memory connector to receive the computer memory component, and the cooling tube is to be removably coupled with a memory component heat spreader associated with the computer memory component. In some embodiments, the support may be a liquid manifold. Other embodiments may be described and/or claimed.
Ming Zhang - Shanghai, CN Michael T. Crocker - Portland OR, US Xiaofeng Shawn Sheng - Shanghai, CN Alan W. Tate - Puyallup WA, US Shanjun Deng - Shanghai, CN Kapil Kane - Shanghai, CN Minglei Wang - Shanghai, CN Russell Beauregard - Portland OR, US
International Classification:
G06F 1/16 H01R 31/00
Abstract:
An electronic device may be provided that includes a base portion having an input device, a tablet having a display and a docking connector with a plurality of second electrical connectors, and a docking connector to move relative to the base portion. The docking connector may include a first docking pole to extend from the docking connector and to engage with the docking receptacle, and a plurality of first electrical connectors.
Chengxue Zhao - Shanghai, CN Ming Zhang - Shanghai, CN Congtao Jiang - Shanghai, CN Alan Tate - Puyallup WA, US
International Classification:
G06F 1/16
US Classification:
36167909
Abstract:
In various embodiments, a transparent hinged substrate apparatus integrated nto a portable computer may address common deficiencies associated with space limitations on student desktop surfaces. The transparent hinged substrate apparatus may utilize, in some embodiments, a transparent substrate that is positioned between the display side and the keypad side of a portable computer. The transparent hinged substrate apparatus may be movable into multiple positions including one position that covers the keypad side of the portable computer without touching any of the keys of the keypad. Thus, the keypad surface may now be used as a work surface using the same physical space occupied by the portable computer.
Blue Origin
Senior Mechanical Engineer
Pensar Development Jun 2016 - Jul 2019
Senior Mechanical Engineer
Intel Corporation 2015 - Jun 2016
Mechanical Server Architect
Intel Corporation 2011 - 2014
Mechanical Team Lead
Intel Corporation 2003 - 2005
Mechanical Architect
Education:
North Carolina State University 1981 - 1985
Bachelors, Bachelor of Science, Mechanical Engineering
Skills:
Engineering Management Manufacturing Product Development Cross Functional Team Leadership Program Management Design For Manufacturing Semiconductors Sheet Metal Electronics Mechanical Engineering Pro Engineer Cad Engineering Product Design Product Management Design of Experiments Testing Product Engineering Intel Manufacturing Engineering Solidworks Debugging Semiconductor Industry Embedded Systems Pcb Design Processors Thermal Analysis Ic
Ministry, 2215 E. Harding Ave., will honor its apostle, Shirley A. Sanders, for 20 years of service to the ministry, at 4 p.m. Sunday, June 12. The guest speaker will be Alan Tate, a prophet at Evangelistic Outreach Church of Pine Bluff. Special music will be by recording artist Kingdom Generation.
Date: Jun 10, 2016
Category: U.S.
Source: Google
Premier League Transfer Talk: August 3 - Clint Dempsey leaves Tottenham ...
eeds for their part make three changes to their side from the one which beat Ipswich 2-0 on Saturday in a slightly less exotic part of the world, with regular cup goalkeeper Jamie Ashdown starting in place of Paddy Kenny and Jason Pearce and Michael Brown taking the field instead of Alan Tate