Albert L Robinson

US Patent:

46062629, Aug 19, 1986

Filed:

Jun 18, 1985

Appl. No.:

6/745954

Inventors:

Albert H. Robinson - Plymouth Meeting PA
Walter W. Egee - late of Wallingford PA

Assignee:

Campbell Soup Company - Camden NJ

International Classification:

A23B 700

US Classification:

99470

Abstract:

Method and apparatus for pasteurizing appropriately sized discrete fresh food pieces are disclosed in which a finite portion of the food pieces is retained in an essentially immobile condition within a confined treatment zone while heating and cooling fluids are sequentially passed in direct contact through the food pieces for providing rapid heating thereof to a pasteurization temperature and similarly rapid cooling to a near ambient temperature so as not to significantly degrade the organoleptic quality of the fresh food pieces.

US Patent:

46363955, Jan 13, 1987

Filed:

Jun 18, 1985

Appl. No.:

6/745956

Inventors:

Albert H. Robinson - Plymouth Meeting PA
Walter W. Egee - late of Wallingford PA

Assignee:

Campbell Soup Company - Camden NJ

International Classification:

A23L 318

US Classification:

426511

Abstract:

Method and apparatus for pasteurizing appropriately sized discrete fresh food pieces are disclosed in which a finite portion of the food pieces is retained in an essentially immobile condition within a confined treatment zone while heating and cooling fluids are sequentially passed in direct contact through the food pieces for providing rapid heating thereof to a pasteurization temperature and similarly rapid cooling to a near ambient temperature so as not to significantly degrade the organoleptic quality of the fresh food pieces.

US Patent:

62923722, Sep 18, 2001

Filed:

Jul 15, 1999

Appl. No.:

9/353386

Inventors:

Kon M. Lin - Pennington NJ
Quentin D. Groves - Oklahoma City OK
Albert W. Robinson - Oklahoma City OK

Assignee:

Lucent Technologies, Inc. - Murray Hill NJ

International Classification:

H05K 334

US Classification:

361760

Abstract:

An improved robber or solder thieving pad, parallelogram shaped, significantly reduces solder bridging in wave soldered multi leaded through hole or surface mounted components in a printed circuit board for different wave settings. The component leads are either parallel or perpendicular to the solder wave during the soldering process. In one embodiment, the parallelogram shaped solder thieving pad is disposed contiguous or adjacent to the through hole. In another embodiment, the parallelogram shaped solder thieving pad is spaced from a thin annular ring surrounding the through-hole. In still another embodiment, the pad may be linked to the ring by a thin connecting bridge. Dimensions of the solder thieving pad vary according to the component lead size, spacing, and number of rows. The design of the pad takes into account the total molten solder volume held in a solder joint and balances the weight of the solder volume, the dynamic solder flow in the wave; and the solder surface tension for improving the drainage behavior of the solder to inhibit solder bridging of the component leads.