Mark A. Unrath - Portland OR, US Andrew Berwick - Portland OR, US Alexander A. Myachin - Beaverton OR, US
Assignee:
ELECTRO SCIENTIFIC INDUSTRIES, INC. - Portland OR
International Classification:
B23K 26/073 B29C 59/16
US Classification:
21912173, 264400, 4251744
Abstract:
A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.
Laser Processing Systems And Methods For Beam Dithering And Skiving
A system includes a laser source, a galvanometer mirror system, an f-theta scan lens and an acousto-optic deflector (AOD) system. The AOD system is operated to deflect a beam path along which a laser beam propagates in a manner that corrects for scan field distortion induced by one or both of the f-theta lens and galvanometer mirror system.
Adaptive Part Profile Creation Via Independent Side Measurement With Alignment Features
- Portland OR, US Alexander Anatolievich MYACHIN - Beaverton OR, US Mark Theodore KOSMOWSKI - Beaverton OR, US
International Classification:
G05B 19/25 G05B 15/02
Abstract:
Alignment features () associated with a support fixture () provide side scan data and top scan data reference points. Side scan displacement sensors () obtain side scan data of workpiece edge segments (), and one or more cameras () obtain top scan data to provide a machining reference for the side scan data. The side scan data can be transformed into a top-view coordinate system usable by the laser machining system ().
Laser Processing Systems And Methods For Beam Dithering And Skiving
- Portland OR, US Andrew Berwick - Portland OR, US Alexander A. Myachin - Beaverton OR, US
International Classification:
B23K 26/36 B23K 26/06 B23K 26/08 B23K 26/073
US Classification:
21912161, 21912178, 21912179, 21912169
Abstract:
A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.