Alexander J Simpson

US Patent:

8439994, May 14, 2013

Filed:

Sep 30, 2010

Appl. No.:

12/895529

Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Ping Huang - Eden Prairie MN, US
Richard Frentzel - Murrieta CA, US
Alexander William Simpson - Hillsboro OR, US

Assignee:

NexPlanar Corporation - Hillsboro OR

International Classification:

B24D 11/00
B24D 3/00
B24D 18/00

US Classification:

51293, 451537

Abstract:

Methods of fabricating polishing pads with end-point detection regions for polishing semiconductor substrates using eddy current end-point detection are described.

US Patent:

8628384, Jan 14, 2014

Filed:

Sep 30, 2010

Appl. No.:

12/895465

Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Ping Huang - Eden Prairie MN, US
Richard Frentzel - Murrieta CA, US
Alexander William Simpson - Hillsboro OR, US

Assignee:

NexPlanar Corporation - Hillsboro OR

International Classification:

B24D 3/28

US Classification:

451526, 451528, 451921, 451 6, 451287

Abstract:

Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

US Patent:

20120083192, Apr 5, 2012

Filed:

Sep 30, 2010

Appl. No.:

12/895479

Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Ping Huang - Eden Prairie MN, US
Richard Frentzel - Murrieta CA, US
Alexander William Simpson - Hillsboro OR, US

International Classification:

B24D 11/00
B24D 3/20
B24D 18/00

US Classification:

451526, 51293, 51296

Abstract:

Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

US Patent:

20120190281, Jul 26, 2012

Filed:

Jan 26, 2011

Appl. No.:

13/014630

Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Alexander William Simpson - Hillsboro OR, US

International Classification:

B24D 11/00
B24D 13/14
B24D 18/00

US Classification:

451527, 51298, 51296

Abstract:

Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described.

US Patent:

20130137350, May 30, 2013

Filed:

Nov 29, 2011

Appl. No.:

13/306845

Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Paul Andre Lefevre - Portland OR, US
James P. LaCasse - Portland OR, US
Alexander William Simpson - Hillsboro OR, US

International Classification:

B24D 7/00
B24D 18/00
B24D 11/00

US Classification:

451539, 451550, 51298, 51296

Abstract:

Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.

US Patent:

20130324020, Dec 5, 2013

Filed:

Jun 4, 2012

Appl. No.:

13/488149

Inventors:

Paul Andre Lefevre - Portland OR, US
William C. Allison - Beaverton OR, US
James P. LaCasse - Portland OR, US
Diane Scott - Portland OR, US
Alexander William Simpson - Hillsboro OR, US
Ping Huang - Beaverton OR, US
Leslie M. Charns - Portland OR, US

International Classification:

B24D 11/00
B24D 18/00

US Classification:

451529, 451527, 51298, 51296

Abstract:

Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.

US Patent:

20170203409, Jul 20, 2017

Filed:

Apr 5, 2017

Appl. No.:

15/479779

Inventors:

- Hillsboro OR, US
William C. ALLISON - Beaverton OR, US
Alexander William SIMPSON - Hillsboro OR, US
Diane SCOTT - Portland OR, US
Ping HUANG - Beaverton OR, US
Leslie M. CHARNS - Portland OR, US
James Richard RINEHART - Portland OR, US
Robert KERPRICH - Portland OR, US

International Classification:

B24B 37/26
B24B 37/22

Abstract:

Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.

US Patent:

20160023322, Jan 28, 2016

Filed:

Oct 5, 2015

Appl. No.:

14/875513

Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Alexander William Simpson - Hillsboro OR, US

International Classification:

B24B 37/26
B24D 11/00

Abstract:

Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described.