Alexander Q Simpson

age ~58

from Los Angeles, CA

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Also known as:

Simpson Alexander
Alex Simpson

Connected to:

Alexander Simpson Phones & Addresses

Los Angeles, CA
Albuquerque, NM
Marina del Rey, CA
Portland, OR
Grosse Ile, MI
Santa Monica, CA

Education

Degree:

J.D.
School / High School:

Duke University School of Law

Ranks

Licence:

New York - Currently registered
Date:

1994

Specialities

Government Contracts • Government • Antitrust / Trade Law

Resumes

Independent Research Professional

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Location:

Orange County, California Area

Industry:

Research

Independent Mental Health Care Professional

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Location:

United States

Industry:

Mental Health Care

Wine And Spirits Professional

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Location:

Greater Los Angeles Area

Industry:

Wine and Spirits

Design Professional

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Location:

Greater Los Angeles Area

Industry:

Design

Student At Saddleback College

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Location:

Orange County, California Area

Industry:

Religious Institutions

Lawyers & Attorneys

Alexander Grant Simpson - Lawyer

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Address:

Licenses:

New York - Currently registered 1994

Experience:

Vice President & General Counsel at Reis, Inc. - 2007-present
Owner/Principal at Alex Simpson PLLC - 2005-2008
Partner at King & Spalding LLP - 2002-2004
Associate at Davis Polk & Wardwell - 1993-2002

Education:

Duke University School of Law
Degree - J.D.
Graduated - 1993
Dartmouth College
Degree - B.A. - Government
Graduated - 1989

Specialties:

Business - 100%, 31 years

Alexander Simpson - Lawyer

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Specialties:

Government Contracts
Government
Antitrust / Trade Law

ISLN:

923282454

Admitted:

2010

Law School:

University of Maryland School of Law, JD

Isbn (Books And Publications)

The Custodians of Western Democracy

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Author
Alexander Russell Simpson

ISBN #
0950011800

Name / Title

Company / Classification

Phones & Addresses

Alexander Simpson
President

Who Face Production Inc
Motion Picture/Video Production

23030 Blue Bird Dr, Calabasas, CA 91302

Alexander Eaton Simpson
President

WHO FACE PRODUCTIONS, INC

5741 Briarcliff Rd, Los Angeles, CA 90068
22156 Dardenne St, Calabasas, CA 91302

Alexander Eaton Simpson
Principal

Whoface Productions
Motion Picture/Video Production

12940 Hesby St, Van Nuys, CA 91423

Us Patents

Method Of Fabricating A Polishing Pad With An End-Point Detection Region For Eddy Current End-Point Detection
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US Patent:

8439994, May 14, 2013
Filed:

Sep 30, 2010
Appl. No.:

12/895529
Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Ping Huang - Eden Prairie MN, US
Richard Frentzel - Murrieta CA, US
Alexander William Simpson - Hillsboro OR, US
Assignee:

NexPlanar Corporation - Hillsboro OR
International Classification:

B24D 11/00
B24D 3/00
B24D 18/00
US Classification:

51293, 451537
Abstract:

Methods of fabricating polishing pads with end-point detection regions for polishing semiconductor substrates using eddy current end-point detection are described.

Polishing Pad For Eddy Current End-Point Detection
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US Patent:

8628384, Jan 14, 2014
Filed:

Sep 30, 2010
Appl. No.:

12/895465
Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Ping Huang - Eden Prairie MN, US
Richard Frentzel - Murrieta CA, US
Alexander William Simpson - Hillsboro OR, US
Assignee:

NexPlanar Corporation - Hillsboro OR
International Classification:

B24D 3/28
US Classification:

451526, 451528, 451921, 451 6, 451287
Abstract:

Polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Homogeneous Polishing Pad For Eddy Current End-Point Detection
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US Patent:

20120083192, Apr 5, 2012
Filed:

Sep 30, 2010
Appl. No.:

12/895479
Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Ping Huang - Eden Prairie MN, US
Richard Frentzel - Murrieta CA, US
Alexander William Simpson - Hillsboro OR, US
International Classification:

B24D 11/00
B24D 3/20
B24D 18/00
US Classification:

451526, 51293, 51296
Abstract:

Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Polishing Pad With Concentric Or Approximately Concentric Polygon Groove Pattern
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US Patent:

20120190281, Jul 26, 2012
Filed:

Jan 26, 2011
Appl. No.:

13/014630
Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Alexander William Simpson - Hillsboro OR, US
International Classification:

B24D 11/00
B24D 13/14
B24D 18/00
US Classification:

451527, 51298, 51296
Abstract:

Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described.

Polishing Pad With Foundation Layer And Polishing Surface Layer
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US Patent:

20130137350, May 30, 2013
Filed:

Nov 29, 2011
Appl. No.:

13/306845
Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Paul Andre Lefevre - Portland OR, US
James P. LaCasse - Portland OR, US
Alexander William Simpson - Hillsboro OR, US
International Classification:

B24D 7/00
B24D 18/00
B24D 11/00
US Classification:

451539, 451550, 51298, 51296
Abstract:

Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.

Polishing Pad With Polishing Surface Layer Having An Aperture Or Opening Above A Transparent Foundation Layer
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US Patent:

20130324020, Dec 5, 2013
Filed:

Jun 4, 2012
Appl. No.:

13/488149
Inventors:

Paul Andre Lefevre - Portland OR, US
William C. Allison - Beaverton OR, US
James P. LaCasse - Portland OR, US
Diane Scott - Portland OR, US
Alexander William Simpson - Hillsboro OR, US
Ping Huang - Beaverton OR, US
Leslie M. Charns - Portland OR, US
International Classification:

B24D 11/00
B24D 18/00
US Classification:

451529, 451527, 51298, 51296
Abstract:

Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.

Polishing Pad Having Polishing Surface With Continuous Protrusions
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US Patent:

20170203409, Jul 20, 2017
Filed:

Apr 5, 2017
Appl. No.:

15/479779
Inventors:

- Hillsboro OR, US
William C. ALLISON - Beaverton OR, US
Alexander William SIMPSON - Hillsboro OR, US
Diane SCOTT - Portland OR, US
Ping HUANG - Beaverton OR, US
Leslie M. CHARNS - Portland OR, US
James Richard RINEHART - Portland OR, US
Robert KERPRICH - Portland OR, US
International Classification:

B24B 37/26
B24B 37/22
Abstract:

Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.

Polishing Pad With Concentric Or Approximately Concentric Polygon Groove Pattern
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US Patent:

20160023322, Jan 28, 2016
Filed:

Oct 5, 2015
Appl. No.:

14/875513
Inventors:

William C. Allison - Beaverton OR, US
Diane Scott - Portland OR, US
Alexander William Simpson - Hillsboro OR, US
International Classification:

B24B 37/26
B24D 11/00
Abstract:

Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described.