Alfred G Ocken

US Patent:

51795019, Jan 12, 1993

Filed:

Feb 24, 1992

Appl. No.:

7/840247

Inventors:

Alfred G. Ocken - Palatine IL
Nathan A. Unterman - Chicago IL
Timothy S. Fisher - Chicago IL
Michael I. Petrites - Schaumburg IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 720

US Classification:

361388

Abstract:

An electronic module assembly includes a relatively thin, bendable base plate having at least one bend axis along which the base plate is bent over on itself to provide an enclosure. An inner surface of the base plate supports at least one, and preferably two, relatively thicker metal plates, one on each side of the bend axis, each metal plate acting as a heatsink for circuit components mounted thereon.

US Patent:

54162785, May 16, 1995

Filed:

Mar 1, 1993

Appl. No.:

8/024046

Inventors:

Fred E. Ostrem - Long Grove IL
Alfred G. Ocken - Palatine IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 102

US Classification:

174263

Abstract:

A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101), or rigidizer, preferably composed of an aluminum material. A solderable contact area (103), is located on the plate (101). This contact area (103) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon. Then, a quantity of solder (113) is disposed onto the solderable area (111), and the assembly (100) is heated so that the solder (113) flows into the vias (106) and (110), thereby providing an electrical connection including the solderable area (111) of the via (110), the solder (113), and the contact area (103).

US Patent:

RE296830, Jun 27, 1978

Filed:

Feb 28, 1977

Appl. No.:

5/773081

Inventors:

Alfred Ocken - Franklin Park IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 506
B29C 602

US Classification:

174 52PE

Abstract:

A control device assembled on a circuit board is suitably encapsulated within a protective housing on a multiple unit basis especially suited for automation. A plurality of housings are arranged in an upright, side-by-side relation so that the associated circuit board may be inserted from a vertical direction and correctly positioned within the housing by a pair of guide rails and the action of gravity. The housings may then be suitably encapsulated utilizing a continuous and uninterrupted flow of encapsulating material. The housing itself is fabricated of a non-metallic, thermosetting material unaffected during subsequent operation in elevated ambient temperatures. The housing further includes a laterally extending lip or ledge which overlies a top portion of the next adjacent housing during assembly and encapsulation. Mounting holes are provided of a configuration to permit a wide variety of mounting locations.

US Patent:

48090573, Feb 28, 1989

Filed:

Dec 18, 1986

Appl. No.:

6/943529

Inventors:

Alfred G. Ocken - Franklin Park IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2332

US Classification:

357 76

Abstract:

An electrical component assembly (10), comprising a rectifier bridge, utilizes a protective cover (30) for mechanical protection of semiconductor diode dies (11, 12) mounted on an aluminum heat sink support carrier (16). Channels (37, 37B) with effective openings (40, 40A) therein are provided in a top surface (38) of the protective cover to facilitate applying an environmental sealing materail (45) through said channels and openings to the semiconductor diode dies of the electrical assembly as well as to various critical electrical interconnections (48) in the electrical assembly. By utilizing the mechanically protective cover to also provide for guiding the application of an environmental sealing material for the electrical assembly, extensive fixturing in providing a desired electrical assembly is minimized, the assembly is rendered more readily manufacturable, and protection of the assembly is provided even during the step of dispensing the sealing material.

US Patent:

6172307, Jan 9, 2001

Filed:

Mar 24, 1995

Appl. No.:

8/410616

Inventors:

Fred E. Ostrem - Long Grove IL
Alfred G. Ocken - Palatine IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01R 909

US Classification:

174263

Abstract:

A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101), or rigidizer, preferably composed of an aluminum material. A solderable contact area (103), is located on the plate (101). This contact area (103) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon. Then, a quantity of solder (113) is disposed onto the solderable area (111), and the assembly (100) is heated so that the solder (113) flows into the vias (106) and (110), thereby providing an electrical connection including the solderable area (111) of the via (110), the solder (113), and the contact area (103).

US Patent:

48720895, Oct 3, 1989

Filed:

Dec 19, 1988

Appl. No.:

7/286001

Inventors:

Alfred G. Ocken - Franklin Park IL
Michael L. Charlier - Palatine IL
Raymond J. Kowieski - Mt. Prospect IL

Assignee:

Motorola Inc. - Schaumburg IL

International Classification:

H05K 720

US Classification:

361388

Abstract:

A heat sink assembly for a plurality of transistors includes specially-formed spring clips and a specially-formed heat sink to hold the transistors firmly on the heat sink, and a lead protector that mates with the heat sink to receive and protect the leads of the transistors during handling. The lead protector and the heat sink include integrally-formed fastener/alignment pins for aligning the lead protector with the heat sink, and for aligning the completed heat sink assembly with a circuit board and for holding the assembly securely fastened to the circuit board. A particular feature of the lead protector permits it to mate with heat sink in a first discrete position in which it receives and protects the transistor leads, and to more closely mate with the heat sink in a second discrete position in which the transistor leads pass through the lead protector and into target holes in the circuit board.

US Patent:

47106573, Dec 1, 1987

Filed:

Sep 9, 1986

Appl. No.:

6/906570

Inventors:

Alfred G. Ocken - Franklin Park IL
Raymond E. Nordbrock - St. Charles IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H02K 902

US Classification:

310 62

Abstract:

An inexpensive semi enclosed alternator provides high power prolonged operation in environments having particle contamination in the ambient atmosphere. An alternator housing has front and rear housing portions, and a drive shaft carrying a rotor assembly is within the housing. A drive shaft extension from the housing holds a fan assembly. The rear housing portion has cylindrical sidewalls joined to a closed end portion 27 and forms an air sealed cavity except for an open end facing the front housing portion. The front housing portion comprises cylindrical sidewalls, having through-openings therein, which terminate in a first end opening 31, facing rear housing open end 28, and a substantially open second end opening 30 facing the fan assembly and the ambient atmosphere. Preferably rotor and stator assemblies, and rectifying diodes, are positioned within the housing substantially between the through openings and the closed end portion of the rear housing. During normal drive shaft rotation, the fan assembly draws cooling ambient air into the housing through the through-openings 33, and this air is then drawn out of the housing through the second end opening 30 of the front housing portion.