Allan S. Lane - Trempealeau WI Curtis P. Henningson - Winona MN Steven T. Beck - Minnesota City MN
Assignee:
EMD Associates, Inc. - Winona MN
International Classification:
H01R 1341 H05K 1304
US Classification:
29845
Abstract:
An apparatus and method for first inserting wire pins in a printed circuit board and then bending the pins in progressive die fashion by means of a bending ram. The apparatus consists of an improved insertion and bending ram for use with a pin insertion machine. The improved insertion and bending ram comprises primary and secondary rams held in position by a tooling head, each ram comprising at least two bending notches. The primary ram is designed to first insert the pin vertically into a hole on a printed circuit board. While the primary ram inserts a second pin vertically, a bending notch of the primary ram bends the first pin downward. While the primary ram inserts a third pin vertically, the second pin is bent downward and the first pin is bent so that it contacts the printed circuit board. The primary ram has at least one bending notch. The secondary bending ram functions in the same manner as the primary bending ram but is used to reach pins not bent by the primary bending ram.