Allen Ray Gibson

US Patent:

20210249304, Aug 12, 2021

Filed:

Feb 11, 2020

Appl. No.:

16/787321

Inventors:

- Boise ID, US
Frank Speetjens - Boise ID, US
Darin S. Miller - Boise ID, US
Siva Naga Sandeep Chalamalasetty - Boise ID, US
Dave Pratt - Meridian ID, US
Yi Hu - Boise ID, US
Aaron K. Belsher - Boise ID, US
Allen R. Gibson - Boise ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 21/768
H01L 23/522

Abstract:

Some embodiments include a method of forming an integrated assembly. An arrangement is formed to include a conductive pillar extending through an insulative mass. An upper surface of the conductive pillar is recessed to form a cavity. An insulative collar is formed within the cavity to line an outer lateral periphery of the cavity. A recessed surface of the conductive pillar is exposed at a bottom of the lined cavity. A conductive expanse is formed over the insulative mass. A portion of the conductive expanse extends into the cavity and is configured as an interconnect. The conductive expanse is patterned into multiple conductive structures. One of the conductive structures includes the interconnect.