Ambarish D Chhatre

US Patent:

20130097840, Apr 25, 2013

Filed:

Oct 20, 2011

Appl. No.:

13/277873

Inventors:

David Schaefer - Fremont CA, US
Ambarish Chhatre - San Jose CA, US
Keith William Gaff - Fremont CA, US
Sung Lee - Pleasanton CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B23P 11/00
H01L 21/3065

US Classification:

29428, 15634552

Abstract:

A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.

US Patent:

20130340942, Dec 26, 2013

Filed:

Jun 20, 2012

Appl. No.:

13/528194

Inventors:

David Schaefer - Fremont CA, US
Ambarish Chhatre - San Jose CA, US
Keith William Gaff - Fremont CA, US
Brooke Mesler Lai - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

F16J 15/02
H02N 13/00

US Classification:

15634551, 29505, 277628

Abstract:

A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.

US Patent:

20130052339, Feb 28, 2013

Filed:

Aug 26, 2011

Appl. No.:

13/219540

Inventors:

Hong Shih - Santa Clara CA, US
Tuochuan Huang - Saratoga CA, US
David Schaefer - Fremont CA, US
Ambarish Chhatre - San Ramon CA, US
John Daugherty - Fremont CA, US
MingHang Wu - Renton WA, US
Clifford La Croix - Livermore CA, US

International Classification:

B05D 5/12

US Classification:

4271264, 427 58

Abstract:

A method is provided for treating a bipolar ESC having a front surface and a back surface, the front surface including an anodized layer. The method includes eliminating the anodized layer, disposing a new anodized layer onto the front surface, and treating the new anodized layer with water to seal the new anodized layer.

US Patent:

20210225616, Jul 22, 2021

Filed:

Jan 7, 2019

Appl. No.:

16/960017

Inventors:

- Fremont CA, US
Ambarish (Rish) Chhatre - Danville CA, US
Dan Marohl - San Jose CA, US
Tamarak Pandhumsoporn - Fremont CA, US
Ignacio (Nacho) Chazaro - Mountain View CA, US

International Classification:

H01J 37/32
B24C 1/06

Abstract:

Components and processes are disclosed herein for managing non-volatile and/or low-volatility byproduct materials that are generated within a plasma processing region of a plasma processing chamber during performance of various plasma-based processes on a substrate. The components include a top window structure, a liner structure, an edge ring structure, a focus ring structure, a ground ring structure, a substrate access port shield, an insert liner for a port opening in a chamber wall, and an exhaust baffle assembly for positioning within an exhaust channel connected to the chamber. One or more process-exposed surface(s) of the various components are subjected to a surface roughening/texturizing process to impart a surface roughness and/or engineered topography to the process-exposed surface that promotes adhesion and retention of plasma process byproduct materials. The various components with roughened/texturized process-exposed surface(s) are configured for use in lead zirconate titanate (PZT) film etching and/or platinum (Pt) film etching processes.

US Patent:

20200234920, Jul 23, 2020

Filed:

Jan 22, 2019

Appl. No.:

16/253948

Inventors:

- Fremont CA, US
Dan MAROHL - San Jose CA, US
Ambarish CHHATRE - Danville CA, US
Ming-Te LIN - Danville CA, US
Andras KUTHI - Thousand Oaks CA, US

International Classification:

H01J 37/32
H01L 21/67

Abstract:

An apparatus for processing substrates is provided. A plasma processing chamber is provided. At least one substrate support for supporting at least one substrate is in the plasma processing chamber. At least one gas inlet is provided for flowing gas into the plasma processing chamber. A dielectric window forms a cover for the plasma processing chamber. The dielectric window comprises an outer dielectric window ring with a central aperture and an inner concaved dielectric window extending across the central aperture, wherein the inner concaved dielectric window forms a volume in fluid communication with an interior of the plasma processing chamber, and wherein the at least one gas inlet flows gas into the volume of the inner concaved dielectric window. An outer coil assembly is adjacent to the outer dielectric window ring. An inner coil assembly surrounds the inner concaved dielectric window.

US Patent:

20180106371, Apr 19, 2018

Filed:

Dec 15, 2017

Appl. No.:

15/843849

Inventors:

- Fremont CA, US
Ambarish Chhatre - San Jose CA, US
Keith William Gaff - Fremont CA, US
Sung Lee - Pleasanton CA, US
Brooke Mesler Lai - Fremont CA, US

International Classification:

F16J 15/02
H01J 37/32
H02N 13/00
H01L 21/683

Abstract:

An edge seal for sealing an outer surface of a lower electrode assembly configured to support a semiconductor substrate in a plasma processing chamber, the lower electrode assembly including an annular groove defined between a lower member and an upper member of the lower electrode assembly. The edge seal includes an elastomeric band configured to be arranged within the groove, the elastomeric band having an annular upper surface, an annular lower surface, an inner surface, and an outer surface. When the elastomeric band is in an uncompressed state, the outer surface of the elastomeric band is concave. When the upper and lower surfaces are axially compressed at least 1% such that the elastomeric band is in a compressed state, an outward bulging of the outer surface is not greater than a predetermined distance. The predetermined distance corresponds to a maximum outer diameter of the elastomeric band in the uncompressed state.

US Patent:

20150235889, Aug 20, 2015

Filed:

May 5, 2015

Appl. No.:

14/704602

Inventors:

- Fremont CA, US
Tuochuan Huang - Saratoga CA, US
David Schaefer - Fremont CA, US
Ambarish Chhatre - San Ramon CA, US
John Daugherty - Fremont CA, US
MingHang Wu - Renton WA, US
Clifford La Croix - Livermore CA, US

Assignee:

LAM RESEARCH CORPORATION - Fremont CA

International Classification:

H01L 21/683

Abstract:

A method is provided for treating a bipolar ESC having a front surface and a back surface, the front surface including an anodized layer. The method includes eliminating the anodized layer, disposing a new anodized layer onto the front surface, and treating the new anodized layer with water to seal the new anodized layer.