Andres M Garcia

Address:

16451 Havenhurst Dr, Houston, TX 77059

VIN:

1D8GT28K87W534962

Make:

DODGE

Model:

NITRO

Year:

2007

Address:

4701 Anderson Rd TRLR 235, Houston, TX 77053

Phone:

2818795738

VIN:

1GKDT13S152149528

Make:

GMC

Model:

ENVOY

Year:

2007

US Patent:

7033257, Apr 25, 2006

Filed:

Jul 21, 2004

Appl. No.:

10/895574

Inventors:

Andres B. Garcia - Ocoee FL, US
Jose Omar Rodriguez - Orlando FL, US
Charles A. Storey - Orlando FL, US

Assignee:

Agere Systems, Inc. - Allentown PA

International Classification:

B24B 29/00
B24B 5/00

US Classification:

451288, 451398

Abstract:

A carrier head for supporting a wafer during a chemical mechanical polishing process is provided. In one exemplary implementation, the carrier head may comprise a wear ring, and a slidably movable pressure plate disposed within the wear ring. The pressure plate may be arranged to provide slidable movement relative to the wear ring. This degree of freedom can accommodate height dimensional changes that may occur in the wear ring.

US Patent:

7172496, Feb 6, 2007

Filed:

Aug 17, 2005

Appl. No.:

11/205382

Inventors:

Jose Omar Rodriguez - Orlando FL, US
Charles A. Storey - Orlando FL, US
Andres B. Garcia - Ocoee FL, US
Margareth Seputro - Orlando FL, US
Frank Miceli - Orlando FL, US

Assignee:

Agere Systems, Inc. - Allentown PA

International Classification:

B24B 55/00

US Classification:

451 41, 451 67, 451288

Abstract:

Disclosed herein is a process for diminishing contamination of an integrated circuit wafer caused by residual slurry components disposed on a back side of a carrier for engaging an integrated circuit wafer. Also disclosed is a CMP machine configured to wash a back side of a carrier.

US Patent:

7338569, Mar 4, 2008

Filed:

Sep 29, 2004

Appl. No.:

10/953477

Inventors:

Jose Omar Rodriguez - Orlando FL, US
Charles A. Storey - Orlando FL, US
Andres B. Garcia - Ocoee FL, US
Margareth Seputro - Orlando FL, US
Frank Miceli - Orlando FL, US

Assignee:

Agere Systems Inc. - Allentown PA

International Classification:

B32B 41/00

US Classification:

156 64, 451 5, 451 6, 451458

Abstract:

A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a turntable, while a sensor tip contacts the edge of a polishing pad positioned on the turntable. This provides an assessment of radial displacement of the polishing pad edge at this measurement point relative to the side of the turntable. Based on one or more such measurements, the polishing pad may be found acceptably positioned, may be trimmed, or may be replaced. The method and system reduce or eliminate the occurrence of a defect pattern found to be related to side unloading of semiconductor wafers from a CMP turntable.

US Patent:

7527544, May 5, 2009

Filed:

Jan 3, 2008

Appl. No.:

11/968930

Inventors:

Jose Omar Rodriguez - Orlando FL, US
Charles A. Storey - Orlando FL, US
Andres B. Garcia - Ocoee FL, US
Margareth Seputro - Orlando FL, US
Frank Miceli - Orlando FL, US

Assignee:

Agere Systems Inc. - Allentown PA

International Classification:

B24B 49/00
B24B 51/00

US Classification:

451 5, 451 9, 451285

Abstract:

A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a turntable, while a sensor tip contacts the edge of a polishing pad positioned on the turntable. This provides an assessment of radial displacement of the polishing pad edge at this measurement point relative to the side of the turntable. Based on one or more such measurements, the polishing pad may be found acceptably positioned, may be trimmed, or may be replaced. The method and system reduce or eliminate the occurrence of a defect pattern found to be related to side unloading of semiconductor wafers from a CMP turntable.

US Patent:

20070010180, Jan 11, 2007

Filed:

Jul 6, 2005

Appl. No.:

11/175855

Inventors:

Andres Garcia - Ocoee FL, US
Frank Miceli - Orlando FL, US
Jose Rodriguez - Orlando FL, US
Margareth Seputro - Orlando FL, US
Charles Storey - Orlando FL, US

International Classification:

B24B 41/06

US Classification:

451364000

Abstract:

Disclosed herein is an improved carrier design for use in a chemical mechanical polishing process. The carrier employs a retainer ring that is fastened to the side of carrier, as opposed to the front of the carrier, which alleviates undesired uneven wear of the retainer ring surface. Specifically exemplified herein is a carrier comprising a membrane that is secured to the carrier body by a retainer ring that is snap-fitted to the carrier body.

US Patent:

20070072128, Mar 29, 2007

Filed:

Sep 28, 2005

Appl. No.:

11/237569

Inventors:

Frank Miceli - Orlando FL, US
Jose Rodriguez - Orlando FL, US
Andres Garcia - Ocoee FL, US
Charles Storey - Orlando FL, US

International Classification:

G03F 7/20

US Classification:

430311000

Abstract:

A method of manufacturing an integrated circuit in which the method comprises exposing a wafer to an energy source defining a focal plane with which a depth of focus is associated and conforming the wafer to substantially correspond with the focal plane.

US Patent:

20150267518, Sep 24, 2015

Filed:

Sep 8, 2014

Appl. No.:

14/479687

Inventors:

Andres Garcia - Rosenberg TX, US
Nervy E. Faria - Houston TX, US
Britain Fisher - Houston TX, US
Christophe Malbrel - Houston TX, US
Vasily Eliseev - Richmond TX, US
Michael Ma - Houston TX, US

Assignee:

Baker Hughes Incorporated - Houston TX

International Classification:

E21B 43/12
E21B 36/00
E21B 33/124
E21B 34/06
E21B 43/14
E21B 43/04

Abstract:

An isolation method is described for gravel packed zones separated by at least one packer and having an auxiliary conduit passing through the packer into adjacent zones. The conduit includes at least one each of a shunt tube, flow housing, annular space, and isolation valve housing. The flow housing, the annular space, and the isolation valve housing are all annular and formed between two concentric pipes. The method includes running in an assembly of screens isolated by at least one packer with at least one auxiliary conduit extending into adjacent zones defined by the packer when the packer is subsequently set. The method also includes closing flow in said conduit to prevent flow into shunt tubes during production based on creating a flow barrier in the annular space, the flow housing, or the isolation valve housing, the shunt tubes supplying slurry through the auxiliary conduit prior to the production.

US Patent:

20140332224, Nov 13, 2014

Filed:

May 9, 2013

Appl. No.:

13/890327

Inventors:

Eguaoje J. Pogoson - Humble TX, US
Charles T. Kirkpatrick - New Caney TX, US
Nicholas J. Clem - Houston TX, US
Ian M. LeBlanc - Spring TX, US
Jonathan N. Croy - Katy TX, US
Andres Garcia - Houston TX, US
Kenneth J. Chauvin - Spring TX, US

Assignee:

BAKER HUGHES INCORPORATED - Houston TX

International Classification:

E21B 34/04

US Classification:

166359, 166368

Abstract:

A method of completing a subsea borehole including connecting a first vessel to a subsea wellhead assembly via a riser. A borehole is drilled with a drill string communicated to the subsea wellhead assembly through the riser. A lower completion assembly is run on a service string into the borehole through the riser. At least two barrier valves of the lower completion assembly are set with the service string in order to form a mechanical barrier to fluid flow with each of the at least two barrier valves. The riser is disconnected from the subsea wellhead assembly. An upper completion string is run through open water to the borehole and connected to the lower completion assembly. An lower completion assembly for a subsea borehole is also included.