Andres Y Garcia

US Patent:

7033257, Apr 25, 2006

Filed:

Jul 21, 2004

Appl. No.:

10/895574

Inventors:

Andres B. Garcia - Ocoee FL, US
Jose Omar Rodriguez - Orlando FL, US
Charles A. Storey - Orlando FL, US

Assignee:

Agere Systems, Inc. - Allentown PA

International Classification:

B24B 29/00
B24B 5/00

US Classification:

451288, 451398

Abstract:

A carrier head for supporting a wafer during a chemical mechanical polishing process is provided. In one exemplary implementation, the carrier head may comprise a wear ring, and a slidably movable pressure plate disposed within the wear ring. The pressure plate may be arranged to provide slidable movement relative to the wear ring. This degree of freedom can accommodate height dimensional changes that may occur in the wear ring.

US Patent:

7172496, Feb 6, 2007

Filed:

Aug 17, 2005

Appl. No.:

11/205382

Inventors:

Jose Omar Rodriguez - Orlando FL, US
Charles A. Storey - Orlando FL, US
Andres B. Garcia - Ocoee FL, US
Margareth Seputro - Orlando FL, US
Frank Miceli - Orlando FL, US

Assignee:

Agere Systems, Inc. - Allentown PA

International Classification:

B24B 55/00

US Classification:

451 41, 451 67, 451288

Abstract:

Disclosed herein is a process for diminishing contamination of an integrated circuit wafer caused by residual slurry components disposed on a back side of a carrier for engaging an integrated circuit wafer. Also disclosed is a CMP machine configured to wash a back side of a carrier.

US Patent:

7338569, Mar 4, 2008

Filed:

Sep 29, 2004

Appl. No.:

10/953477

Inventors:

Jose Omar Rodriguez - Orlando FL, US
Charles A. Storey - Orlando FL, US
Andres B. Garcia - Ocoee FL, US
Margareth Seputro - Orlando FL, US
Frank Miceli - Orlando FL, US

Assignee:

Agere Systems Inc. - Allentown PA

International Classification:

B32B 41/00

US Classification:

156 64, 451 5, 451 6, 451458

Abstract:

A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a turntable, while a sensor tip contacts the edge of a polishing pad positioned on the turntable. This provides an assessment of radial displacement of the polishing pad edge at this measurement point relative to the side of the turntable. Based on one or more such measurements, the polishing pad may be found acceptably positioned, may be trimmed, or may be replaced. The method and system reduce or eliminate the occurrence of a defect pattern found to be related to side unloading of semiconductor wafers from a CMP turntable.

US Patent:

7527544, May 5, 2009

Filed:

Jan 3, 2008

Appl. No.:

11/968930

Inventors:

Jose Omar Rodriguez - Orlando FL, US
Charles A. Storey - Orlando FL, US
Andres B. Garcia - Ocoee FL, US
Margareth Seputro - Orlando FL, US
Frank Miceli - Orlando FL, US

Assignee:

Agere Systems Inc. - Allentown PA

International Classification:

B24B 49/00
B24B 51/00

US Classification:

451 5, 451 9, 451285

Abstract:

A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a turntable, while a sensor tip contacts the edge of a polishing pad positioned on the turntable. This provides an assessment of radial displacement of the polishing pad edge at this measurement point relative to the side of the turntable. Based on one or more such measurements, the polishing pad may be found acceptably positioned, may be trimmed, or may be replaced. The method and system reduce or eliminate the occurrence of a defect pattern found to be related to side unloading of semiconductor wafers from a CMP turntable.

US Patent:

8114431, Feb 14, 2012

Filed:

Sep 19, 2007

Appl. No.:

11/857819

Inventors:

Andres J. Garcia - Atlanta GA, US
Catherine D. Reyes - Miami FL, US
Timothy Petrie - Atlanta GA, US
Zvi Schwartz - Atlanta GA, US
Barbara D. Boyan - Atlanta GA, US
Jenny E. Raynor - E. Sandwich MA, US
David M. Collard - Atlanta GA, US
Abigail M. Wojtowicz - Atlanta GA, US
Robert E. Guldberg - Marietta GA, US

Assignee:

Georgia Tech Research Corporation - Atlanta GA

International Classification:

A61F 2/00
A61K 38/00
A61K 51/00
C07K 2/00
C07K 4/00
C07K 5/00
C07K 7/00
C07K 9/00
C07K 16/00
C07K 17/00

US Classification:

424423, 530300, 424 169, 514 11

Abstract:

Methods and compositions are provided for improving tissue growth and device integration in vivo. Substrates and devices coated with an αβor αβintegrin-specific ligand are provided. The substrates and devices coated with an αβor αβintegrin-specific ligand are shown to have greater tissue formation on the surface relative to controls, in particular greater bone formation.

US Patent:

20060237390, Oct 26, 2006

Filed:

Apr 14, 2006

Appl. No.:

11/279808

Inventors:

William King - Smyrna GA, US
Andres Garcia - Atlanta GA, US
Joseph Charest - Atlanta GA, US
Nathan Gallant - Atlanta GA, US

International Classification:

B44C 1/22
C23F 1/00

US Classification:

216041000, 216052000

Abstract:

The invention is a method for fabricating a cell culture surface substrate, comprising the steps of a) forming a cell culture surface having a mechanical topography, b) forming a synthetic chemical pattern using a chemical pattern template, and c) combining the cell culture surface having a mechanical topography and the synthetic chemical pattern. Mechanical topography is defined as a pattern of mechanical structures with regular and specifically designed features. The synthetic chemical pattern is defined as a group of features of specific chemistry different from the chemistry of their surroundings that have regular and specifically designed features.

US Patent:

20070010180, Jan 11, 2007

Filed:

Jul 6, 2005

Appl. No.:

11/175855

Inventors:

Andres Garcia - Ocoee FL, US
Frank Miceli - Orlando FL, US
Jose Rodriguez - Orlando FL, US
Margareth Seputro - Orlando FL, US
Charles Storey - Orlando FL, US

International Classification:

B24B 41/06

US Classification:

451364000

Abstract:

Disclosed herein is an improved carrier design for use in a chemical mechanical polishing process. The carrier employs a retainer ring that is fastened to the side of carrier, as opposed to the front of the carrier, which alleviates undesired uneven wear of the retainer ring surface. Specifically exemplified herein is a carrier comprising a membrane that is secured to the carrier body by a retainer ring that is snap-fitted to the carrier body.

US Patent:

20070072128, Mar 29, 2007

Filed:

Sep 28, 2005

Appl. No.:

11/237569

Inventors:

Frank Miceli - Orlando FL, US
Jose Rodriguez - Orlando FL, US
Andres Garcia - Ocoee FL, US
Charles Storey - Orlando FL, US

International Classification:

G03F 7/20

US Classification:

430311000

Abstract:

A method of manufacturing an integrated circuit in which the method comprises exposing a wafer to an energy source defining a focal plane with which a depth of focus is associated and conforming the wafer to substantially correspond with the focal plane.