Andrew E Carlson

US Patent:

20130069275, Mar 21, 2013

Filed:

Sep 20, 2011

Appl. No.:

13/237375

Inventors:

Etienne Menard - Durham NC, US
John A. Rogers - Champaign IL, US
Seok Kim - Urbana IL, US
Andrew Carlson - Urbana IL, US

International Classification:

B29C 59/02

US Classification:

264293, 425385

Abstract:

In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.

US Patent:

20160381789, Dec 29, 2016

Filed:

Mar 29, 2016

Appl. No.:

15/084112

Inventors:

- Urbana IL, US
Matthew MEITL - Durham NC, US
Yugang SUN - Naperville IL, US
Heung Cho KO - Gwangju, KR
Andrew CARLSON - Urbana IL, US
Won Mook CHOI - Gyeonggi-do, KR
Mark STOYKOVICH - Dover NH, US
Hanqing JIANG - Chandler AZ, US
Yonggang HUANG - Glencoe IL, US
Ralph G. NUZZO - Champaign IL, US
Zhengtao ZHU - Rapid City SD, US
Etienne MENARD - Durham NC, US
Dahl-Young KHANG - Seoul, KR

International Classification:

H05K 1/02
H05K 3/22
H01L 21/48
H01L 23/538

Abstract:

In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

US Patent:

20140374872, Dec 25, 2014

Filed:

Mar 20, 2014

Appl. No.:

14/220910

Inventors:

- Urbana IL, US
Matthew MEITL - Durham NC, US
Yugang SUN - Naperville IL, US
Heung Cho KO - Gwangju, KR
Andrew CARLSON - Urbana IL, US
Won Mook CHOI - Gyeonggi-do, KR
Mark STOYKOVICH - Dover NH, US
Hanqing JIANG - Chandler AZ, US
Yonggang HUANG - Glencoe IL, US
Ralph G. NUZZO - Champaign IL, US
Zhengtao ZHU - Rapid City SD, US
Etienne MENARD - Durham NC, US
Dahl-Young KHANG - Seoul, KR

Assignee:

THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS - Urbana IL

International Classification:

H01L 27/12
H01L 21/02
H01L 29/06

US Classification:

257499, 438478

Abstract:

In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.