Andrew Lyle Collins

US Patent:

6776226, Aug 17, 2004

Filed:

Mar 12, 2003

Appl. No.:

10/388031

Inventors:

Chih-Min Cheng - Westford MA
Andrew Collins - Amherst NH

Assignee:

National Starch and Chemical Investment Holding Corporation - New Castle DE

International Classification:

F28F 700

US Classification:

165185, 165905, 361704

Abstract:

A thermal interface member in a heat generating, electronic device is provided. The thermal interface member comprises either a single fluoroelastomer or a blend of fluoroelastomer components that are copolymers of hexafluoropropylene and vinylidene and consists of greater than 40% fluorine along the backbone, and one or more conductive fillers. The fluoroelastomer blend contains at least one component with a Mooney viscosity of 50 poise or less and at least one component with a Mooney viscosity of greater than 50 poise, while the single fluoroelastomer component may have a Mooney viscosity of either less than or greater than 50.

US Patent:

6874573, Apr 5, 2005

Filed:

Jul 31, 2003

Appl. No.:

10/632330

Inventors:

Andrew Collins - Bedford NH, US
Chih-Min Cheng - Westford MA, US

Assignee:

National Starch and Chemical Investment Holding Corporation - New Castle DE

International Classification:

F28F007/00

US Classification:

165185, 165905

Abstract:

A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of nitrile rubber and carboxyl-terminated butadiene, carboxyl-terminated butadiene nitrile or a mixture thereof, and conductive filler particles.

US Patent:

7326369, Feb 5, 2008

Filed:

Mar 7, 2005

Appl. No.:

11/073778

Inventors:

Chih-Min Cheng - Westford MA, US
Andrew Collins - Bedford NH, US

Assignee:

National Starch and Chemical Investment Holding Corporation - New Castle DE

International Classification:

H01B 1/12
H01B 1/02
H01B 1/08

US Classification:

25251933, 252512, 2525181

Abstract:

A low stress conductive film or paste adhesive that comprises a) one or more functional acrylic copolymers or terpolymers; b) epoxy; and c) conductive filler. Additional ingredients, such as adhesion promoters and conductivity enhancers may also be utilized. The conductive film or paste adhesive provides higher adhesion strength than traditional flexible conductive film adhesives and a lower stress between the bonded components than existing high adhesion strength conductive films.

US Patent:

20040180209, Sep 16, 2004

Filed:

Mar 12, 2003

Appl. No.:

10/388028

Inventors:

Chih-Min Cheng - Westford MA, US
Andrew Collins - Bedford NH, US

International Classification:

B32B027/00

US Classification:

428/421000

Abstract:

A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of fluoroelastomer components that are copolymers of hexafluoropropylene and vinylidene and consists of greater than 40% fluorine along the backbone, and conductive filler particles. The blend contains at least one component with a Mooney viscosity of 50 poise or less and at least one component with a Mooney viscosity of greater than 50 poise.

US Patent:

20050250910, Nov 10, 2005

Filed:

Jul 8, 2005

Appl. No.:

11/178138

Inventors:

Chih-Min Cheng - Westford MA, US
Andrew Collins - Bedford NH, US

International Classification:

C08L033/04

US Classification:

525222000

Abstract:

A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of fluoroelastomer components that are copolymers of hexafluoropropylene and vinylidene and consists of greater than 40% fluorine along the backbone, and conductive filler particles. The blend contains at least one component with a Mooney viscosity of 50 poise or less and at least one component with a Mooney viscosity of greater than 50 poise.

US Patent:

20070179232, Aug 2, 2007

Filed:

Jan 30, 2006

Appl. No.:

11/275786

Inventors:

Andrew Collins - Bedford NH, US
Chih-Min Cheng - Westford MA, US

Assignee:

National Starch and Chemical Investment Holding Corporation - New Castle DE

International Classification:

C08K 3/22

US Classification:

524413000, 524432000, 524433000, 524444000, 524494000, 524556000

Abstract:

A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of acrylic polymer, one or more liquid resins, conductive filler particles and optionally one or more solid resins.

US Patent:

20070212551, Sep 13, 2007

Filed:

Mar 10, 2006

Appl. No.:

11/373437

Inventors:

Andrew Collins - Bedford NH, US

International Classification:

B32B 27/00
C08L 63/00
C09J 163/00
C09K 19/52

US Classification:

428414000, 428001530, 525523000, 156330000

Abstract:

An adhesive utilized in various electronic applications. One such adhesive is a B-stageable adhesive that offers excellent adhesion to electronic components, such as lids and substrates comprising various materials, including liquid crystal polymer. The adhesive provides latency and the ability to provide a thorough seal between lids and substrates, including those comprising LCP. The adhesive comprises a solvent, one or more solid epoxies, one or more latent hardeners and one or more thixotropic agents.

US Patent:

20130067701, Mar 21, 2013

Filed:

Sep 19, 2011

Appl. No.:

13/236415

Inventors:

James T. Grady - Chester NH, US
Peter Iannazzi - Hampstead NH, US
Thomas O Brien - New Boston NH, US
Clinton Dowd - Goffstown NH, US
Andrew Collins - Bedford NH, US

International Classification:

A44B 18/00
B05D 3/00
G01J 3/00
B32B 38/00
B05D 5/00
B05D 3/12
B32B 37/00

US Classification:

24442, 427358, 427299, 156280, 427256, 356 51

Abstract:

A method of making a laminated touch fastener includes introducing a flexible substrate to a resin applicator, applying flowable resin to a limited region of a surface of the substrate, and molding the applied resin to form a plurality of defined structures extending from a layer of the applied resin. The substrate surface, as the substrate is introduced to the resin applicator, has a surface characteristic that varies across the surface. The surface includes both a first region and a second region adjacent the first region, the surface characteristic varying to a greater degree within the second region than within the first region. The flowable resin may be applied within the first region such that an edge of the resin layer is disposed within, and adjacent an exposed portion of, the first region of the substrate surface.