Andrew P Le

US Patent:

6764265, Jul 20, 2004

Filed:

Jan 7, 2002

Appl. No.:

10/041291

Inventors:

Charles S. Kunze - Cupertino CA
Andrew V. Le - San Jose CA
Muhammad Rasheed - Fremont CA

Assignee:

Applied Materials Inc. - Santa Clara CA

International Classification:

B65G 1133

US Classification:

4142171, 251193, 251324, 414217, 414939

Abstract:

Embodiments of the present invention provide structures for reducing erosion of a slit valve utilized in the fabrication of semiconductor devices. Specifically, non-metallic slit valve components such as a compressible sealing member and a barrier that assist in sealing the valve closure against the slit valve seat, are positioned on the valve seat rather than on the valve closure. This orientation removes the seal and the seal barrier from the direct line of sight of the plasma within the processing chamber, reducing exposure of the sealing member and seal barrier slit valve components to erosion and thereby extending the lifetime of the valve.

US Patent:

7983776, Jul 19, 2011

Filed:

Nov 8, 2007

Appl. No.:

11/937027

Inventors:

Miles Dudman - Mountain View CA, US
Andrew Le - San Jose CA, US

Assignee:

Micrel, Inc. - San Jose CA

International Classification:

G06F 19/00

US Classification:

700 97, 700121

Abstract:

The present invention is one or more implementations is a method of fabricating a semiconductor for improved oxide thickness control, defining a process tool, determining and evaluating performance variables, determining a performance impact factor and thereafter modifying control of the process tool in the fabrication process to operate in direct relation to the determined results of the present invention. The present invention sets forth definitive advantages in reducing engineering time, improving process controls and improving cycle-times.

US Patent:

8616920, Dec 31, 2013

Filed:

May 16, 2011

Appl. No.:

13/108359

Inventors:

Devin Bertrum Pauley - Dallas TX, US
Jonathan J. Wollak - Woodridge IL, US
Andrew Phong Le - Arlington TX, US

Assignee:

BlackBerry Limited - Waterloo

International Classification:

H01R 24/00

US Classification:

439630, 439159

Abstract:

An apparatus comprises an assembly and a SIM-card tray configured to move, at least partially, into and out of the assembly to thereby selectively electrically connect and disconnect a SIM card that is disposed in the SIM-card tray to and from at least one electrical connector. A biasing member automatically urges movement of the SIM-card tray with respect to at least one of moving the SIM-card tray into the assembly and out of the assembly. By one approach this biasing member comprises a spring. By one approach this spring can serve to both automatically urge movement of the SIM-card tray into the assembly and out of the assembly. These teachings will accommodate a SIM-card tray configured to accommodate a micro-SIM card. These teachings will also accommodate a personal communication device having the aforementioned components.

US Patent:

20040222651, Nov 11, 2004

Filed:

Oct 26, 2002

Appl. No.:

10/281771

Inventors:

Andrew Le - San Jose CA, US

International Classification:

B65G007/12

US Classification:

294/015000

Abstract:

A handle-frame set for attachment to a container or a bulky object to facilitate lifting and carrying of said container or bulky object, comprising a frame part and a handle part with the resultant handle formed by displacement of the lower portion of the frame part whereby the formed handle is locked into position. An adhesive layer for attaching to a surface is affixed on the back side of the frame part and the handle part and a protective layer is releaseably affixed to the back side of the adhesive layer.

US Patent:

20100007363, Jan 14, 2010

Filed:

Dec 3, 2007

Appl. No.:

11/949245

Inventors:

Miles DUDMAN - Mountain View CA, US
Andrew LE - San Jose CA, US
Daniel ANDERSON - Fremont CA, US

Assignee:

Micrel, Inc. - San Jose CA

International Classification:

G01R 27/08

US Classification:

324715

Abstract:

The present invention relates generally to semiconductor wafer fabrication and more particularly but not exclusively to advanced process control methodologies for measuring in-line contact resistance in relation to oxide formations. The present invention, in one or more implementations, include an in-line method of determining contact resistance across a semiconductor wafer and determining the contact resistance value and the number of monolayers of the wafer.

US Patent:

D3639010, Nov 7, 1995

Filed:

Mar 28, 1994

Appl. No.:

D/020478

Inventors:

Andrew D. Le - San Jose CA

US Classification:

D11222

US Patent:

20190323960, Oct 24, 2019

Filed:

Jun 27, 2019

Appl. No.:

16/455689

Inventors:

- Santa Clara CA, US
Xuesong LU - Santa Clara CA, US
Andrew V. LE - Los Gatos CA, US
Fa JI - Dublin CA, US
Jang Seok OH - San Ramon CA, US
Patrick L. SMITH - Vancouver WA, US
Shawyon JAFARI - Sunnyvale CA, US
Ralph Peter ANTONIO - Los Gatos CA, US

International Classification:

G01N 21/53
H01L 21/67
H01L 21/677
G01N 1/22

Abstract:

An FI having an in-situ particle detector and a method for particle detection therein are provided. In one aspect, the FI includes a fan, a substrate support, a particle detector, and an exhaust outlet. The fan, substrate support, and particle detector are arranged such that, in operation, the fan directs air towards the exhaust outlet and over a substrate on the substrate support to create laminar flow. The particle detector, positioned downstream from the substrate support and upstream from the exhaust outlet, analyzes the air and detects particle concentration before the particles are exhausted. The collected particle detection data may be combined with data from other sensors in the FI and used to identify the source of particle contamination. The particle detector may also be incorporated into other system components, including but not limited to, a load-lock or buffer chamber to detect particle concentration therein.

US Patent:

20190169743, Jun 6, 2019

Filed:

Feb 5, 2019

Appl. No.:

16/268194

Inventors:

- Santa Clara CA, US
Xuesong LU - Santa Clara CA, US
Andrew V. LE - San Jose CA, US
Jang Seok OH - San Ramon CA, US

International Classification:

C23C 16/455
H01J 37/32
C23C 16/507
C23C 16/44
C23C 16/34
C23C 16/505
C23C 16/40

Abstract:

Embodiments described herein relate to apparatus and coating methods to reduce chamber arcing, for example, in HDP-CVD, PECVD, PE-ALD and Etch chambers. The apparatus include a ring shaped gas distributor used for in-situ deposition of coating materials, and a process chamber including the same. The ring shaped gas distributor includes a ring shaped body having at least one gas entrance port disposed on a first side thereof and a plurality of gas distribution ports disposed on a first surface of the ring shaped body. The plurality of gas distribution ports are arranged in a plurality of evenly distributed rows. The plurality of gas distribution ports in a first row of the plurality of evenly distributed rows is adapted to direct gas at an exit angle different from an exit angle of the plurality of gas distribution ports in a second row of the plurality of evenly distributed rows.