Andrew J Reid

US Patent:

20210014979, Jan 14, 2021

Filed:

Jul 9, 2020

Appl. No.:

16/924747

Inventors:

- San Jose CA, US
Scott Joseph Jewler - San Jose CA, US
Freddie Erich Babian - Palo Alto CA, US
Andrew George Reid - San Jose CA, US
Benjamin Thomas Adler - San Jose CA, US

International Classification:

H05K 3/40
H05K 1/11
G01N 23/04
G01T 1/20

Abstract:

In one embodiment, an X-ray inspection system may nondestructively inspect a printed circuit board to measure a number of dimensions at a number of pre-determined locations of the printed circuit board. The X-ray inspection system may generate a data set for the printed circuit board based on the measured dimensions. The X-ray inspection system may calculate one or more drilling values based on the data set of the printed circuit board. The X-ray inspection system may provide, to a drilling machine, instructions for drilling a number of plated-through vias based on the calculated drilling values for the printed circuit board.

US Patent:

20200380654, Dec 3, 2020

Filed:

Mar 25, 2020

Appl. No.:

16/830108

Inventors:

- San Jose CA, US
Andrew George REID - San Jose CA, US

Assignee:

SVXR, INC. - San Jose CA

International Classification:

G06T 7/00
G06K 9/62

Abstract:

The present disclosure provides methods and apparatus for rapidly classifying detected defects in subcomponents of a manufactured component or device. The defect classification may occur after defect detection or, because the classification may be sufficiently rapid to be performed in real-time, during defect detection, as part of the defect detection process. In an exemplary implementation, the presently-disclosed technology may be utilized to enable real-time classification of detected defects in multiple subcomponents of the component in parallel. The component may be, for example, a multi-chip package with silicon interposers, and the subcomponents may include, for example, through-silicon vias and solder joints. Defects in subcomponents of other types of components may be also be classified. One embodiment relates to a method of classifying detected defects in subcomponents of a manufactured component. Another embodiment relates to a product manufactured using a disclosed method of inspecting multiple subcomponents of a component for defects.