Anh T Hoang

US Patent:

6654132, Nov 25, 2003

Filed:

May 24, 2000

Appl. No.:

09/577795

Inventors:

Charles W. Schietinger - Portland OR
Anh N. Hoang - San Jose CA
Dmitry V. Bakin - San Jose CA

Assignee:

Luxtron Corporation - Santa Clara CA

International Classification:

G01B 1128

US Classification:

356630, 356625, 356600, 3562372

Abstract:

A characteristic of a surface is measured by illuminating the surface with optical radiation over a wide angle and receiving radiation reflected from the surface over an angle that depends on the extend of the illumination angle. An emissivity measurement is made for the surface, and, alternatively, if a reflectivity measurement is made, it becomes more accurate. One application is to measure the thickness of a layer or layers, either a layer made of transparent material or a metal layer. A one or multiple wavelength technique allow very precise measurements of layer thickness. Noise from ambient radiation is minimized by modulating the radiation source at a frequency where such noise is a minimum or non-existent. The measurements may be made during processing of the surface in order to allow precise control of processing semiconductor wafers, flat panel displays, or other articles. A principal application is in situ monitoring of film thickness reduction by chemical-mechanical-polishing (CMP).

US Patent:

6934040, Aug 23, 2005

Filed:

Sep 26, 2003

Appl. No.:

10/672558

Inventors:

Charles W. Schietinger - Portland OR, US
Anh N. Hoang - San Jose CA, US
Dmitry V. Bakin - San Jose CA, US

Assignee:

Luxtron Corporation - Santa Clara CA

International Classification:

G01B011/28

US Classification:

356630, 356600, 3562372

Abstract:

A characteristic of a surface is measured by illuminating the surface with optical radiation over a wide angle and receiving radiation reflected from the surface over an angle that depends on the extend of the illumination angle. An emissivity measurement is made for the surface, and, alternatively, if a reflectivity measurement is made, it becomes more accurate. One application is to measure the thickness of a layer or layers, either a layer made of transparent material or a metal layer. A one or multiple wavelength technique allow very precise measurements of layer thickness. Noise from ambient radiation is minimized by modulating the radiation source at a frequency where such noise is a minimum or non-existent. The measurements may be made during processing of the surface in order to allow precise control of processing semiconductor wafers, flat panel displays, or other articles. A principal application is in situ monitoring of film thickness reduction by chemical-mechanical-polishing (CMP).

US Patent:

7042581, May 9, 2006

Filed:

Dec 15, 2004

Appl. No.:

11/013070

Inventors:

Charles W. Schietinger - Portland OR, US
Anh N. Hoang - San Jose CA, US
Dmitry V. Bakin - San Jose CA, US

Assignee:

Luxtron Corporation - Santa Clara CA

International Classification:

G01B 11/28
G01B 11/02

US Classification:

356630, 356503, 3562371, 3562372

Abstract:

A characteristic of a surface is measured by illuminating the surface with optical radiation over a wide angle and receiving radiation reflected from the surface over an angle that depends on the extend of the illumination angle. An emissivity measurement is made for the surface, and, alternatively, if a reflectivity measurement is made, it becomes more accurate. One application is to measure the thickness of a layer or layers, either a layer made of transparent material or a metal layer. A one or multiple wavelength technique allow very precise measurements of layer thickness. Noise from ambient radiation is minimized by modulating the radiation source at a frequency where such noise is a minimum or non-existent. The measurements may be made during processing of the surface in order to allow precise control of processing semiconductor wafers, flat panel displays, or other articles. A principal application is in situ monitoring of film thickness reduction by chemical-mechanical-polishing (CMP).

Address:

23119 96 Pl S, Kent, WA 98031

VIN:

JTEEW44AX82025465

Make:

TOYOTA

Model:

HIGHLANDER HYBRID

Year:

2008