Mark Roger Brown - Greenville SC, US Thomas Frank Fric - Greer SC, US Thomas Edward Johnson - Greer SC, US Anne Elizabeth Kolman - Niskayuna NY, US
Assignee:
General Electric Company - Schenectady NY
International Classification:
F23R 3/42
US Classification:
60752, 431356
Abstract:
A combustion liner for a gas turbine combustion system is provided. The combustion liner comprises a combustion zone between an inlet end and an exhaust end. The combustion liner comprises a one-piece casting construction. The combustion liner is formed from a nickel-based superalloy having strength characteristics.
Multi-Nozzle Combustion End Cover Vacuum Brazing Process
Dean Henry Castaldo - Chatham NY Bernard Arthur Couture - Latham NY Anne Elizabeth Kolman - Niskayuna NY David Robert Schumacher - Scotia NY
Assignee:
General Electric Co. - Schenectady NY
International Classification:
B21D 3904 B23K 100 B23K 119 B23K 2016 B23K 2022
US Classification:
228126
Abstract:
A brazing process is provided that addresses the braze joint failure problems encountered in some multi-nozzle combustion end covers. The brazing process embodying the invention provides optimal, predictable low cycle fatigue joint life in particular when brazing 304L stainless steel parts using Amdry 915 braze alloy. The invention was realized in particular in the combination of and application of tightly controlled vital variables of gap, braze alloy, braze peak temperature hold time, cooling (quench) rate, surface finish and braze media to optimal limits for the process parameters. The process provides robust/reliable design limits for braze joints experiencing stress during operation.
Solder Interconnection Structure For Joining Semiconductor Devices To Substrates That Have Improved Fatigue Life, And Process For Making
Keith F. Beckham - Newburgh NY Anne E. Kolman - Wappingers Falls NY Kathleen M. McGuire - Fishkill NY Karl J. Puttlitz - Wappingers Falls NY Horatio Quinones - Peekskill NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2350 H01L 2158 H05K 706 H05K 334
US Classification:
357 80
Abstract:
An improved solder interconnection for forming I/O connections between an integrated semiconductor device and a support substrate having a plurality of solder connections arranged in an area array joining a set of I/O's on a flat surface of the semiconductor device to a corresponding set of solder wettable pads on a substrate, the improvement being a band of dielectric organic material disposed between and bonded to the device and substrate embedding at least an outer row of solder connections leaving the center inner solder connections and the adjacent top and bottom surfaces free of dielectric material.