Anthony V La

US Patent:

6712670, Mar 30, 2004

Filed:

Dec 27, 2001

Appl. No.:

10/033671

Inventors:

Anthony de la Llera - Union City CA
Xuyen Pham - Fremont CA
Andrew Siu - Union City CA
Tuan A. Nguyen - San Jose CA
Tony Luong - San Jose CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 4900

US Classification:

451 11, 451 19, 451 24, 451307

Abstract:

An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.

US Patent:

6746313, Jun 8, 2004

Filed:

Oct 24, 2001

Appl. No.:

09/999066

Inventors:

Xuyen Pham - Fremont CA
Anthony de la Llera - Union City CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 100

US Classification:

451 41, 451285, 451286, 451287, 451288, 451289, 451397, 451398

Abstract:

A polishing head assembly for use in a chemical mechanical planarization apparatus is provided. The polishing head assembly includes a carrier head shaped substantially like a disk having a circumference, a top surface, a bottom surface, and an outer wall, the outer wall having a groove therein, the groove extending into the carrier head from the bottom surface of the carrier head, and the groove running the entire circumference of the carrier head; and a retainer ring having an interior wall and an exterior wall, the interior wall of the retainer ring being in contact with the outer wall of the carrier head, the interior wall having a slot therein, the slot defining a lower portion of the interior wall as a flexible leg, the flexible leg having a receiving end that is adapted to secure an object having a surface to be polished, the slot having a first terminal end adjacent to the groove in the carrier head and a second terminal end, opposite the first terminal end, in the body of the retainer ring. A carrier head is provided, as is a retainer ring. A method of compensating for uneven force distribution in a chemical mechanical planarization apparatus is also provided.

US Patent:

6761626, Jul 13, 2004

Filed:

Dec 20, 2001

Appl. No.:

10/037452

Inventors:

Anthony de la Llera - Union City CA
Xuyen Pham - Fremont CA
David Wei - Fremont CA
Tony Luong - San Jose CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 722

US Classification:

451303, 451307

Abstract:

An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.

US Patent:

6949016, Sep 27, 2005

Filed:

Mar 29, 2002

Appl. No.:

10/112399

Inventors:

Anthony de la Llera - Union City CA, US
Xuyen Pham - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B005/00
B24B021/18

US Classification:

451285, 451443, 451 56

Abstract:

A chemical mechanical planarization (CMP) conditioning apparatus is provided. The CMP conditioning apparatus is designed to connect to a positioning arm which is capable of applying the conditioning apparatus to a processing surface. Embodiments of the CMP conditioning apparatus include a housing configured to connect to the positioning arm, and one side of the housing having a concave gimbal surface. A puck holder that a convex gimbal surface configured to mate with the concave gimbal surface of the housing is further provided. Thee puck holder receives a conditioning puck that has an attach surface and an active surface. The concave gimbal surface and the convex gimbal surface define a projected gimbal point at about a plane defined at about the active surface of the conditioning puck.

US Patent:

7018276, Mar 28, 2006

Filed:

Jun 25, 2004

Appl. No.:

10/876415

Inventors:

Anthony de la Llera - Union City CA, US
Xuyen Pham - Fremont CA, US
David Wei - Fremont CA, US
Tony Luong - San Jose CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 7/22
B24B 21/08

US Classification:

451303, 451307

Abstract:

An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.

US Patent:

7226055, Jun 5, 2007

Filed:

Jun 30, 2003

Appl. No.:

10/611227

Inventors:

Gregory R. Bettencourt - Fremont CA, US
Anthony de la Llera - Fremont CA, US
Xuyen N. Pham - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B23B 31/18

US Classification:

279106, 118503, 118730, 134149, 134153, 134902

Abstract:

A substrate holding apparatus is provided. The substrate holding apparatus includes a chuck yoke, a plurality of arm assemblies, and a plurality of gripper assemblies. A first end of each of the arm assemblies is connected to the chuck yoke and each of the arm assemblies has a spring. A second end of each of the arm assemblies is connected to a respective one of the plurality of grippers. The chuck yoke is capable of rotating so as to move each of the plurality of arm assemblies and respective plurality of gripper assemblies into either a closed position or an open position. A compression force from each of the springs is applied to a substrate when the grippers are moved to the closed position.

US Patent:

7854820, Dec 21, 2010

Filed:

Dec 15, 2006

Appl. No.:

11/639264

Inventors:

Anthony De La Llera - Fremont CA, US
Allan K. Ronne - Santa Clara CA, US
Jaehyun Kim - Fremont CA, US
Jason Augustino - Fremont CA, US
Rajinder Dhindsa - San Jose CA, US
Saurabh J. Ullal - South San Francisco CA, US
Anthony J. Norell - Newark CA, US
Keith Comendant - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

H01L 21/306
C23C 16/00

US Classification:

15634534, 118715

Abstract:

Components of a plasma processing apparatus includes a backing member with gas passages attached to an upper electrode with gas passages. To compensate for the differences in coefficient of thermal expansion between the metallic backing member and upper electrode, the gas passages are positioned and sized such that they are misaligned at ambient temperature and substantially concentric at an elevated processing temperature. Non-uniform shear stresses can be generated in the elastomeric bonding material, due to the thermal expansion. Shear stresses can either be accommodated by applying an elastomeric bonding material of varying thickness or using a backing member comprising of multiple pieces.

US Patent:

8419959, Apr 16, 2013

Filed:

Sep 17, 2010

Appl. No.:

12/884269

Inventors:

Gregory R. Bettencourt - Fremont CA, US
Gautam Bhattacharyya - San Ramon CA, US
Sandy Chao - Sunol CA, US
Anthony de la Llera - Fremont CA, US
Pratik Mankidy - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

C03C 15/00
C03C 25/68
H01L 21/302
H01L 21/461
C23F 1/00
H01L 21/306

US Classification:

216 67, 438710, 15634534

Abstract:

An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the showerhead electrode.