Anthony L Weeks

US Patent:

52275892, Jul 13, 1993

Filed:

Dec 23, 1991

Appl. No.:

7/812486

Inventors:

Anthony R. Weeks - Gilbert AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 100

US Classification:

174263

Abstract:

A plated-through hole solder thief for inhibiting solder bridges between adjacent leads of an integrated circuit and simultaneously providing for electrical interconnection of certain leads of the integrated circuit to other surfaces or layers of a printed wiring board. Plated-through holes are used as solder thieves and are located in the proximity of the last solder pad in a row of solder pads. The plated-through hole draws the solder from the last solder pad to fill the plated-through hole and inhibit bridging between functional leads of the integrated circuit as well as make an electrical interconnection between the last lead of the integrated circuit in each row and other surfaces or layers of the printed wiring board. The plated-through hole is located askew from the rows of solder pads so that functional use may be made of the plated-through hole once it is filled to provide a test point for testing the integrated circuit.

US Patent:

57034931, Dec 30, 1997

Filed:

Oct 25, 1995

Appl. No.:

8/548109

Inventors:

Anthony R. Weeks - Gilbert AZ
Mark D. Norris - Mesa AZ
Steven A. Switzer - Phoenix AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G01R 104

US Classification:

324755

Abstract:

A semiconductor substrate (15) is placed into a recessed area (12) of a support structure (10). A ring (20) is then placed on the support structure (10) to form a wafer holder (30) which provides support to the semiconductor substrate (15) during handling, transporting, or electrical testing operations. The recessed area (12) can also have a vacuum opening (13) and a vacuum groove (17) so a vacuum pressure can be applied to the backside of semiconductor substrate (15). This will correct for any warpage or bowing in the semiconductor substrate (15) so a planar surface is formed for the electrical testing operation. The wafer holder (30) also has a flat (16) so the wafer holder (30) can be aligned and processed like a wafer with a diameter larger than the semiconductor substrate (15).

US Patent:

56928734, Dec 2, 1997

Filed:

Sep 4, 1996

Appl. No.:

8/707369

Inventors:

Anthony R. Weeks - Gilbert AZ
Todd R. Beasley - Tempe AZ
Craig D. Gordy - Scottsdale AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B65G 4724

US Classification:

414627

Abstract:

An apparatus for and method of holding a semiconductor wafer (11) during a manufacturing process supports the semiconductor wafer (11) in a substantially planar form (15) with a two-platform wafer chuck (19). The two-platform wafer chuck (19) is compatible with handling warped and unwarped wafers, wafer transferring and handling techniques which maintain wafer flatness, and semiconductor manufacturing processes such as photolithography and auto-probing which require semiconductor wafers to be held in a flat configuration.

US Patent:

57834873, Jul 21, 1998

Filed:

Feb 20, 1996

Appl. No.:

8/603294

Inventors:

Anthony R. Weeks - Gilbert AZ
Vincent J. Kasarskis - Scottsdale AZ
Henry L. Eudy - Tempe AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2144

US Classification:

438685

Abstract:

A semiconductor device (10) includes a semiconductor substrate (11) underlying an oxide layer (12). A layer (13) comprised of titanium overlies the oxide layer (12). The oxide layer (12) improves the adhesion of the layer (13) comprised of titanium to the semiconductor substrate (11).

US Patent:

52543625, Oct 19, 1993

Filed:

Oct 23, 1992

Appl. No.:

7/965811

Inventors:

Gregory S. Shaffer - Tempe AZ
Anthony R. Weeks - Gilbert AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

C23C 2600

US Classification:

427 96

Abstract:

A method and apparatus for uniformly depositing solder paste on a printed wiring board. A squeegee arrangement applies solder paste through a stencil to a surface of a printed wiring board. As the squeegee assembly is moved in one planar direction over the stencil in a planar fashion, it is also vibrated by a vibrator to produce slight circular motion in addition to the planar motion of the squeegee blade.

US Patent:

52421007, Sep 7, 1993

Filed:

Jan 19, 1993

Appl. No.:

8/005950

Inventors:

Anthony R. Weeks - Gilbert AZ

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B23K 3102

US Classification:

2281801

Abstract:

A plated-through hole solder thief for inhibiting solder bridges between adjacent leads of an integrated circuit and simultaneously providing for electrical interconnection of certain leads of the integrated circuit other surfaces or layers of a printed wiring board. Plated-through holes are used as solder thieves and are located in the proximity of the last solder pad in a row of solder pads. The plated-through hole draws the solder from the last solder pad to fill the plated-through hole and inhibit bridging between functional leads of the integrated circuit as well as make an electrical interconnection between the last lead of the integrated circuit in each row and other surfaces or layers of the printed wiring board. The plated-through hole is located askew from the rows of solder pads so that functional use may be made of the plated-through hole once it is filled to provide a test point for testing the integrated circuit.