Antonio Dinapoli from 1986 Scenic Gulf Dr, Destin, FL 32550, Phone: 8508377662

Method Of Securing Semi-Conductor Wafer Using Retention Clip
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US Patent:

52534111, Oct 19, 1993
Filed:

Aug 14, 1992
Appl. No.:

7/929938
Inventors:

Antonio DiNapoli - Austin TX
Gerald L. Goff - Austin TX
Roger A. Sikes - Austin TX
Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:

B25B 100
B23Q 700
US Classification:

29559
Abstract:

A clip for removably securing a semi-conductor wafer to the treatment surface of a semi-conductor wafer processing pedestal. The clip is constructed with a pair of spaced apart, forwardly extending tines adapted to engage outer edges of a semi-conductor wafer supported upon the treatment surface. A clip tail is oppositely disposed from the tines and affords resilient movement of the tines toward and away from the edges of the pedestal treatment surface to enable the installation and removal of the wafer therefrom.

Wafer Processing Cassette Handle
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US Patent:

50299220, Jul 9, 1991
Filed:

Feb 20, 1990
Appl. No.:

7/482180
Inventors:

Antonio DiNapoli - Austin TX
Gerald L. Goff - Austin TX
Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:

B65D 2528
US Classification:

294 271
Abstract:

A removable handle for use in handling semi-conductor wafer processing cassettes includes a horizontally extending front coupling bar with coupling channels on each end for engaging flanges on the cassette. A handle includes a body portion which is mountable to and extends transversely from the coupling bar. A grip portion extends angularly from the body and is furnished with contoured finger portions. The grip includes a finger trigger for actuating a spring biased resilient plunger mechanism to engage the sidewall of the cassette and secure it to the coupling bar. The grip also includes a thumb latch for releasing the plunger mechanism, in resonse to the spring bias, and allowing the handle to be disengaged from the cassette.

Semi-Conductor Wafer Retention Clip
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US Patent:

51832453, Feb 2, 1993
Filed:

Nov 21, 1990
Appl. No.:

7/617008
Inventors:

Antonio DiNapoli - Austin TX
Gerald L. Goff - Austin TX
Roger A. Sikes - Austin TX
Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:

B25B 100
US Classification:

269254R
Abstract:

A clip for removably securing a semi-conductor wafer to the treatment surface of a semi-conductor wafer processing pedestal. The clip is constructed with a pair of spaced apart, forwardly extending tines adapted to engage outer edges of a semi-conductor wafer supported upon the treatment surface. A clip tail is oppositely disposed from the tines and affords resilient movement of the tines toward and away from the edges of the pedestal treatment surface to enable the installation and removal of the wafer therefrom.