ViewTEQ Corp Deerfield Beach, FL Jul 2008 to Feb 2012 Sr. Mechanical Design EngineerViewsonics Inc., Division of Emerson Electric Co. Pompano Beach, FL Mar 1994 to Jan 2007 Mechanical Design EngineerITW MIMA Boca Raton, FL May 1992 to 1994 Electro-mechanical technicianRailroad Car Repair Plant Gomel, USSR 1979 to 1989 Plant Equipment and Stationary Engineer
Education:
ACT Ferndale, MI Jan 1990 to Jan 1990 Certificate in Mechanical designer-AutoCAD operatorPK Technologies Oak Park, MI Jan 1990 to Jan 1990 Certificate in Computer Application Processor, CAD operatorByelorussian Engineering Institute Gomel, USSR Jan 1977 Engineer, equivalent BSME in Electro-Mechanical
A locking terminator mechanism comprises a connector body with a novel protrusion, and a corresponding tool with a cavity. In a preferred embodiment the protrusion and the cavity each comprises a double D profile. The connector body's protrusion is configured to mate with the tool's cavity to allow selective locking and unlocking of the connector body to the CATV output port. The present invention also comprises a method for locking and unlocking a CATV connector from an output port.
U Form-Factor Intelligent Electronic Device (Ied) Hardware Platform With Matching Of Ied Wiring, From A Non U Form-Factor Ied Hardware Platform Using Adapter Structure
- Zurich, CH Yaser A. Khalifa - New Paltz PA, US Frantisek Koudelka - Brno, CZ Arkady Oksengorn - Boca Raton FL, US Siu Lau - Hampton NJ, US Hardik Patel - Bethlehem PA, US In Y. Choi - Plymouth Meeting PA, US
Assignee:
ABB Technology AG - Zurich
International Classification:
H05K 7/02 H05K 13/00
US Classification:
361730, 29831
Abstract:
A method and apparatus provides an Intelligent Electronic Device (IED) with new hardware modules. Hardware modules are provided that are configured for electrically connecting with connections of a first IED housing that has a first form factor. A second IED housing is provided having a second form factor that is different from the first form factor. The hardware modules are mounted in the second housing. Adaptor structure is employed to electrically connect the hardware modules with connections of the second housing. The second housing is mounted into an existing wiring and second form factor environment.
Mechanical Assembly And Method To Provide Form-Factor And Wire Alike Adaptation Of Existing Platform Hardware Modules Into New Products
- Zurich, CH Yaser A. Khalifa - New Paltz PA, US Frantisek Koudelka - Brno, CZ Arkady Oksengorn - Boca Raton FL, US Siu Lau - Hampton NJ, US Hardik Patel - Bethlehem PA, US In Y. Choi - Pymouth Meeting PA, US
Assignee:
ABB Technology AG - Zurich
International Classification:
H05K 7/14 H05K 3/32
US Classification:
361730, 29832
Abstract:
An Intelligent Electronic Device (IED) includes a plurality of hardware modules including a pair of analog input modules (AIM) modules, a Power Supply Module (PSM), and a Binary Input/Output (BIO) module. Each module is configured for mounting in a first IED housing that has a first form factor. The PSM and BIO module are constructed and arranged to directly connect with electrical connections of the first housing. A second IED housing is provided that has a second form factor that is different from the first form factor. The AIM modules are mounted to a bottom panel of the second housing. The PSM and the BIO module are mounted in the second housing. Wiring electrically connects the AIM modules to connections on the second housing. Adaptor structure electrically connects the PSM and the BIO module with associated connections of the second housing.
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