Arthur K Lin

age ~61

from Oceanside, CA

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Also known as:

Arthur Living Lin
Arthur Lin Living

Connected to:

Arthur Lin Phones & Addresses

Oceanside, CA
Chandler, AZ
Carlsbad, CA
16844 1St St, Phoenix, AZ 85045 • 4804603873
San Diego, CA
Maricopa, AZ
1665 E Glenhaven Dr, Phoenix, AZ 85048

Work

Position:

Production Occupations

Specialities

Property Management

Us Patents

Grounding Of Package Substrates
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US Patent:

6566741, May 20, 2003
Filed:

Oct 21, 1999
Appl. No.:

09/425275
Inventors:

Arthur K. Lin - Phoenix AZ
Robert A. Anderson - Elkgrove CA
Kuljeet Singh - Orangevale CA
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H01L 2302
US Classification:

257678, 257684, 257687
Abstract:

An apparatus and method for dissipating static electrical charge following a manufacturing operation is disclosed. A semiconductor package is provided with ground pads that are located to assure electrical contact with ejection pins used to translate the package from one position to another. Static electricity builds up on the semiconductor package. The ejection pins provide the pathway for dissipating static electrical charge out of the semiconductor package.

Method Of Dissipating Static Electric Charge From A Chip Assembly During A Manufacturing Operation
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US Patent:

6764877, Jul 20, 2004
Filed:

Feb 25, 2003
Appl. No.:

10/374415
Inventors:

Arthur K. Lin - Phoenix AZ
Robert A. Anderson - Elkgrove CA
Kuljeet Singh - Orangevale CA
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H01L 2144
US Classification:

438106, 438121
Abstract:

An apparatus and method for dissipating static electrical charge following a manufacturing operation is disclosed. A semiconductor package is provided with ground pads that are located to assure electrical contact with ejection pins used to translate the package from one position to another. Static electricity builds up on the semiconductor package. The ejection pins provide the pathway for dissipating static electrical charge out of the semiconductor package.

Method Of Forming An Integrated Circuit Substrate
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US Patent:

6858475, Feb 22, 2005
Filed:

Jun 30, 2003
Appl. No.:

10/612282
Inventors:

Charan K. Gurumurthy - Chandler AZ, US
Hamid Azimi - Chandler AZ, US
Arthur K. Lin - Phoenix AZ, US
Assignee:

Intel Corporation - Santa Clara CA
International Classification:

H01L021/82
US Classification:

438128, 438129, 438612, 438614, 438674
Abstract:

A method of forming an integrated circuit substrate that may be adapted to be attached to one or more electronic components. The method includes applying a resist to a back side of a substrate which includes patterned conductive layers on a front side and a back side of the substrate. The method further includes removing part of the patterned conductive layer from the front side of the substrate to form pads and interconnects on the front side of the substrate and applying another resist to the front side of the substrate. The method also includes forming a pattern in each resist that exposes the pads on the front and back sides of the substrate and applying electrolytic nickel to the pads on the substrate.

Resumes

Pathfinding Development Supply Chain Engineer And Commodity Manager

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Location:

16826 south 1St Ave, Phoenix, AZ 85023

Industry:

Semiconductors

Work:

Intel Corporation
Pathfinding Development Supply Chain Engineer and Commodity Manager
Aloca Electronic Packaging 1989 - 1996
Asia Customer Application Representative
Interamic 1988 - 1989
R and D Electronic Packaging Engineer

Education:

Uc San Diego
Bachelor of Science In Mechanical Engineering, Bachelors, Engineering

Skills:

Supply Management
Cross Functional Team Leadership
Spc
Manufacturing
Global Sourcing
Semiconductors
Six Sigma
Strategic Sourcing
Design of Experiments
Materials Management
Lean Manufacturing
Continuous Improvement
Supplier Quality
Statistical Process Control
Supply Chain
Dmaic
Mrp
Procurement
Substrates
Supply Chain Management
Supplier Evaluation

Owner

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Work:

Zpcp
Owner

Arthur Lin

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Arthur Lin

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Vice President

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Work:

Vice President

Senior Staff Device Engineer

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Work:

Senior Staff Device Engineer

Arthur Lin

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Owner, Zpcp

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Position:

Owner at ZPCP

Location:

United States

Industry:

Alternative Dispute Resolution

Work:

ZPCP
Owner

Lawyers & Attorneys

Arthur Lin - Lawyer

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Office:

Law Office of Arthur Lin

Specialties:

Annulment
Alimony
Child Abduction
Child Abuse and Neglect
Child Advocacy
Child Care
Child Custody
Child Custody Mediation
Child Dependency
Child Protection
Child Sexual Abuse
Child Support
Child Welfare
Childrens Rights
Cohabitation Agreements
Collaborative Family Law
Community Property Law
Day Care
Divorce
Divorce Arbitration
Divorce Mediation
Divorce Taxation
Domestic Partnerships
Domestic Relations
Domestic Violence
Family Arbitration
Family Mediation
Grandparents Custody
Grandparents Visitation Rights
International Child Abduction
International Child Custody
International Family Law
Interstate Child Custody
Interstate Support
Legal Separation
Marital Agreements
Marital Property Distribution
Marital Property Law
Marital Property Settlements
Name Changes
No Fault Divorce
Parental Kidnapping
Palimony
Parental Rights
Parenting Time
Paternity
Post Divorce Modification
Post Nuptial Agreements
Premarital Agreements
Restraining Orders
Same Sex Marriage
Spousal Support
Termination of Parental Rights
Third Party Custody
Uncontested Divorce
Visitation Rights

ISLN:

922622472

Admitted:

2009

Law School:

Lincoln Law School of San Jose, J.D., 2007