Asghar L Dadashian

US Patent:

20130248496, Sep 26, 2013

Filed:

Mar 23, 2012

Appl. No.:

13/429033

Inventors:

Reza Imani - Moorpark CA, US
Asghar Dadashian - Porter Ranch CA, US
Dro Darbidian - La Canada-Flintridge CA, US
Hamid Habibi - Calabasas CA, US

Assignee:

PACESETTER, INC. - Sylmar CA

International Classification:

B23K 11/00

US Classification:

219 7801

Abstract:

Disclosed herein is a resistance welding system for welding a ribbon to a bond site of a bond surface. The system includes a welding header, a bond header, a ribbon dispenser, a cutter, and a support surface. The welding header includes a resistance welding tip. The bond header includes a bond foot displaceable relative to the bond surface. The bond foot includes a welding aperture. The ribbon dispenser feeds the ribbon to the bond foot. The support surface is configured to support the bond surface. The bond foot is configured to press the ribbon against the bond site of the bond surface, which is thereby forced against the support surface. With the ribbon so pressed against the bond site, the system is configured to cause the welding tip to enter the welding aperture to resistance weld the ribbon to the bond site of the bond surface.

US Patent:

20120075822, Mar 29, 2012

Filed:

Sep 29, 2010

Appl. No.:

12/893634

Inventors:

Hamid Habibi - Calabasas CA, US
Jin Zhang - Porter Ranch CA, US
Reza Imani - Moorpark CA, US
Asghar Dadashian - Northridge CA, US

Assignee:

PACESETTER, INC. - Sylmar CA

International Classification:

H05K 7/00
B32B 37/02

US Classification:

361783, 156 60

Abstract:

Disclosed herein are electronic devices, such as, for example, televisions, stereo systems, diagnostic equipment, cell phones, desktop or laptop PCs, medical pulse generators, or etc., including an integrated circuit including a printed circuit board including multiple layers and a wire bond pad. The multiple layers are sandwiched together in a planar unitary structure including a top surface, a bottom surface and a structure edge extending between the top surface and the bottom surface. The multiple layers include a first organic substrate layer joined to a second organic substrate layer. Each organic substrate layer includes a layer edge and a peripheral surface adjacent the layer edge. Each layer edge forms part of the structure edge. The wire bond pad includes an outer face, an inner face generally opposite the outer face, and a first rib. The inner face extends along the structure edge. The first rib projects generally perpendicular from the inner face between the first organic substrate layer and the second organic substrate layer and extends along the peripheral surface of at least one of the first organic substrate layer or the second organic substrate layer.