Benjamin T Carroll

US Patent:

6716281, Apr 6, 2004

Filed:

May 10, 2002

Appl. No.:

10/143389

Inventors:

Roger F. Bernards - South Haven MN
Benjamin T. Carroll - Brooklyn Park MN
Alvin A. Kucera - Maple Grove MN

Assignee:

Electrochemicals, Inc. - Maple Plain MN

International Classification:

C09K 1300

US Classification:

10628721, 252 791, 252 792, 252 794, 148 22, 216 13, 216106

Abstract:

The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

US Patent:

6946027, Sep 20, 2005

Filed:

Feb 17, 2004

Appl. No.:

10/782177

Inventors:

Roger F. Bernards - South Haven MN, US
Benjamin T. Carroll - Brooklyn Park MN, US
Alvin A. Kucera - Maple Grove MN, US

Assignee:

Electrochemicals, Inc. - Maple Plain MN

International Classification:

C09K013/00
C09K013/06
B05D003/10

US Classification:

10628732, 10628723, 10628724, 1062873, 148 22, 252 791, 252 792, 252 794, 216 13, 216105, 216106

Abstract:

The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

US Patent:

7108795, Sep 19, 2006

Filed:

Jun 23, 2005

Appl. No.:

11/165097

Inventors:

Roger F. Bernards - South Haven MN, US
Benjamin T. Carroll - Brooklyn Park MN, US
Alvin A. Kucera - Maple Grove MN, US

Assignee:

Electrochemicals, Inc. - Maple Plain MN

International Classification:

C23F 1/00
C23F 1/10
C09K 13/00
C09K 13/06
B05D 3/10

US Classification:

216 13, 216105, 216106, 10628711, 10628713, 10628715, 10628719, 1062872, 10628723, 10628724, 1062873, 10628732, 148 22, 252 791, 252 792, 252 794, 427 988, 427 992, 427118

Abstract:

The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

US Patent:

7563315, Jul 21, 2009

Filed:

Jun 8, 2006

Appl. No.:

11/449349

Inventors:

Roger F. Bernards - South Haven MN, US
Benjamin T. Carroll - Brooklyn Park MN, US
Alvin A. Kucera - Maple Grove MN, US

Assignee:

OMG Electronic Chemicals, Inc. - South Plainfield NJ

International Classification:

C09K 13/00
C09K 13/06
B05D 3/10

US Classification:

10628711, 10628713, 10628715, 10628719, 1062872, 10628723, 1062873, 10628732, 148 22, 252 791, 252 792, 252 794, 216 13, 216105, 216106, 427 988, 427 992, 427118

Abstract:

The invention is directed to a method and composition for providing chemically-resistant roughened copper surfaces suitable for subsequent multilayer lamination. In one embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, a topography modifier, and a sulfur-containing coating stabilizer. In another embodiment, a smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition comprising an oxidizer, a pH adjuster, and a topography modifier. Then, in a subsequent step, the roughened copper surface is contacted with an acid resistance promoting composition.

US Patent:

20070232510, Oct 4, 2007

Filed:

Mar 29, 2006

Appl. No.:

11/392075

Inventors:

Alvin Kucera - Maple Grove MN, US
Benjamin Carroll - Brooklyn Park MN, US

International Classification:

C23G 1/00
C11D 7/32

US Classification:

510175000, 134002000

Abstract:

The current method relates to stripping silver from a printed wiring board. The steps include: providing a printed wiring board comprising a silver deposit on a surface; and contacting the silver deposit with (1) a persulfate salt, (2) an alkaline pH adjuster, and (3) an alkaline-soluble ammonium salt under conditions effective to remove at least a portion of the silver deposit from the surface. The components can be contacted with the silver deposit in an aqueous solution. In one embodiment, the solution is an aqueous solution comprising from about 5% to about 50% by weight of sodium persulfate, from about 0.001% to about 40% by weight of sodium hydroxide and from about 0.01% to about 25% by weight of ammonium hydroxide.

US Patent:

20140069994, Mar 13, 2014

Filed:

Sep 12, 2012

Appl. No.:

13/612198

Inventors:

Benjamin T. Carroll - Brooklyn Park MN, US

Assignee:

BLANK ACQUISITION, LLC D/B/A BLANKS/USA - Brooklyn Park MN

International Classification:

B65D 17/00

US Classification:

229237

Abstract:

A printable blank comprises a sheet with a with outline perforation lines defining a periphery of an object. The sheet is capable of being passed through a printer to have an image printed on it. The sheet also comprises run-out perforation lines extending from the periphery to edges of the sheet, wherein the sheet can be folded along the run-out perforations to detach the object from the sheet. A method for creating custom print structures includes running a printable blank sheet through a printer and then bending the sheet along run-out perforation lines to detach an object from the sheet. The object can then be folded along scored fold lines to assemble it into a three-dimensional structure.

US Patent:

60370203, Mar 14, 2000

Filed:

Jan 29, 1997

Appl. No.:

8/790294

Inventors:

Gregory Dean Garlough - Bloomington MN
Benjamin Todd Carroll - Brooklyn Park MN
Michael Val Carano - Plymouth MN
Frank Polakovic - Ringwood NJ

Assignee:

Electrochemicals Inc. - Maple Plain MN

International Classification:

B05D 512
B05B 100

US Classification:

427600

Abstract:

A method for treating a non-conductive through hole surface of a printed wiring board is disclosed. A printed wiring board including through holes is cleaned, conditioned, and a conductive coating is applied to the initially-nonconductive through hole by contacting it with a series of baths. The conductive coating, for example a graphite dispersion coating, facilitates later electroplating of the conductive surface. While at least partially immersing the through hole in one or more of these baths, ultrasonic energy is introduced in the bath in the vicinity of the through hole. The ultrasonic energy can be introduced during the entire immersing step, before the immersing step, or both. The ultrasonic energy reduces the formation of blowholes during later processing (and especially soldering) of the printed wiring board. The ultrasonic treatment can also improve the dispersion of the conductive particles in a conductive carbon dispersion, reduce or eliminate the formation of pinhole defects, and provide other advantages.

US Patent:

20210008919, Jan 14, 2021

Filed:

Sep 28, 2020

Appl. No.:

17/034952

Inventors:

- Brooklyn Park MN, US
Benjamin Todd Carroll - Brooklyn Park MN, US

International Classification:

B42D 5/00
B41F 23/00
B42D 15/04
B26F 3/00
B41F 23/08

Abstract:

A printable blank sheet includes a sheet with defined separation lines, a first layer with cuts running through the first layer along the defined separation lines, and a second layer attached to a bottom side of the first layer, with perforations running through the second layer along the defined separation lines. A method for creating custom print cards includes running a printable blank sheet through a printer to print on defined print areas, wherein the sheet includes slit-over-perforation lines defining a periphery of an object in the sheet, bending the sheet along the slit-over-perforation lines to weaken and separate the slit-over-perforation lines, and detaching the object from the sheet.