Bernhard E Doerrwaechter

age ~81

from Grand Terrace, CA

Also known as:
  • Bernhard Eugene Doerrwaechter
  • Bernie Doerrwaechter
  • Bernhard E Swann
  • Bernhard R
  • Bernhard E
  • Bernhard T

Bernhard Doerrwaechter Phones & Addresses

  • Grand Terrace, CA
  • Oconomowoc, WI
  • Riverside, CA
  • Inverness, FL
  • Galloway, WI
  • San Bernardino, CA
  • 22985 Finch St, Grand Terrace, CA 92313

Education

  • Degree:
    High school graduate or higher

Us Patents

  • Preformed Thermal Fuse

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  • US Patent:
    6373371, Apr 16, 2002
  • Filed:
    Aug 17, 1999
  • Appl. No.:
    09/376726
  • Inventors:
    Bernhard E. Doerrwaechter - Oconomowoc WI
    Keck C. Pathammavong - Waukesah WI
    Kurt M. Krachenfels - West Allis WI
  • Assignee:
    Microelectronic Modules Corp. - New Berlin WI
  • International Classification:
    H01H 85046
  • US Classification:
    337297, 337290, 337416, 29623
  • Abstract:
    A preformed thermal fuse comprising two electrodes, at least one layer of solder, and a conductive bridge comprising a non-paste solder material is disclosed. The conductive bridge has a melting temperature which is substantially equivalent to the predetermined actuation temperature of the fuse.
  • Preformed Thermal Fuse

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  • US Patent:
    59399694, Aug 17, 1999
  • Filed:
    Aug 29, 1997
  • Appl. No.:
    8/920916
  • Inventors:
    Bernhard E. Doerrwaechter - Oconomowoc WI
    Keck C. Pathammavong - Waukesha WI
    Kurt M. Krachenfels - West Allis WI
  • Assignee:
    Microelectronic Modules Corporation - New Berlin WI
  • International Classification:
    H01H 85046
    H01H 8504
  • US Classification:
    337297
  • Abstract:
    A preformed thermal fuse comprising two electrodes, first and second layers of solder, and a conductive bridge comprising a non-paste solder material is disclosed. The conductive bridge has a melting temperature which is substantially equivalent to the predetermined actuation temperature of the fuse. The melting temperatures of the first and second layers of solder are selected to allow reflow soldering of the device.
  • Heat Actuated Fuse Apparatus With Solder Link

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  • US Patent:
    50972472, Mar 17, 1992
  • Filed:
    Jun 3, 1991
  • Appl. No.:
    7/709683
  • Inventors:
    Bernhard E. Doerrwaechter - Oconomowoc WI
  • Assignee:
    North American Philips Corporation - New York NY
  • International Classification:
    H01H 3776
    H01H 8504
  • US Classification:
    337405
  • Abstract:
    An apparatus for protecting circuitry includes a heat actuated fuse which opens at a predetermined temperature and a resistive device disposed proximate the fuse for heating the fuse in response to an electrical current passed through the device. The fuse includes first and second electrodes bridged by a solder link which melts at the predetermined temperature and retreats to the electrodes. A quantity of flux-containing material is disposed on the link to promote rapid and complete retreat of the solder when the fuse is actuated.
  • Arc Containment System For Lightning Surge Resistor Networks

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  • US Patent:
    56336209, May 27, 1997
  • Filed:
    Dec 27, 1995
  • Appl. No.:
    8/578867
  • Inventors:
    Bernhard Doerrwaechter - Oconomowoc WI
  • Assignee:
    Microelectronic Modules Corporation - New Berlin WI
  • International Classification:
    H01C 710
  • US Classification:
    338 21
  • Abstract:
    A lightning surge resistor network includes a ceramic substrate and a thick-film resistor deposited onto the substrate. To prevent material spatter and to contain and isolate any arcing that can occur in the event the thick-film resistor opens during a severe over voltage condition, a ceramic cover is mounted over the thick-film resistor. The thick-film resistor is thus fully contained between the ceramic substrate and the ceramic cover. Preferably, the ceramic cover is adhered to the ceramic substrate by means of an adhesive film deposited onto either the cover or the substrate adjacent the outer periphery of the cover. Preferably, the mount of adhesive is reduced at preselected locations along the outer periphery of the cover to form weakened areas in the seal between the cover and the substrate. The weakened areas permit gasses to escape in a predetermined direction in the event excessive pressures are formed under the cover when the thick-film resistor opens under an over voltage condition. Preferably, the adhesive is deposited in a pattern that subdivides the volume under the cover into a plurality of cells or isolation areas.

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