Bradley Darryl Hansen

US Patent:

20060033678, Feb 16, 2006

Filed:

Jul 29, 2005

Appl. No.:

11/192993

Inventors:

Dmitry Lubomirsky - Cupertino CA, US
Arulkumar Shanmugasundram - Sunnyvale CA, US
Allen D'Ambra - Burlingame CA, US
Timothy Weidman - Sunnyvale CA, US
Eugene Rabinovich - Fremont CA, US
Svetlana Sherman - San Jose CA, US
Manoocher Birang - Los Gatos CA, US
Yaxin Wang - Fremont CA, US
Michael Yang - Palo Alto CA, US
Bradley Hansen - San Carlos CA, US

International Classification:

G09G 3/00
H05H 1/24
C23C 16/00

US Classification:

345032000, 427576000, 118719000

Abstract:

Embodiments of the invention provide a cluster tool configured to deposit a material onto a substrate surface by using one or more electroless, electrochemical plating, CVD and/or ALD processing chambers. In one aspect, a ruthenium-containing catalytic layer is formed. Embodiments of the invention provide a hybrid deposition system configured to deposit a seed layer on a substrate with an electroless process and to subsequently fill interconnect features on the substrate with an ECP cell. Other aspects provide an electroless deposition system configured to deposit a seed layer on a substrate, fill interconnect features on a substrate, or sequentially deposit both a seed layer and fill interconnect features on the substrate. One embodiment provides an electroless deposition system configured to form a capping layer over substrate interconnects. The system includes a vapor dryer for pre- and post-deposition cleaning of substrates as well as a brush box chamber for post-deposition cleaning.

US Patent:

20070111519, May 17, 2007

Filed:

Jun 30, 2006

Appl. No.:

11/428230

Inventors:

Dmitry Lubomirsky - Cupertino CA, US
Arulkumar Shanmugasundram - Sunnyvale CA, US
Allen D'Ambra - Burlingame CA, US
Timothy Weidman - Sunnyvale CA, US
Michael Stewart - Mountain View CA, US
Eugene Rabinovich - Fremont CA, US
Svetlana Sherman - San Jose CA, US
Manoocher Birang - Los Gatos CA, US
Yaxin Wang - Fremont CA, US
Michael Yang - Palo Alto CA, US
Bradley Hansen - San Carlos CA, US

International Classification:

H01L 21/44

US Classification:

438678000

Abstract:

Embodiments of the invention provide methods for depositing a material onto a surface of a substrate by using one or more electroless, electrochemical plating, CVD and/or ALD processes. Embodiments of the invention provide a method for depositing a seed layer on a substrate with an electroless process and to subsequently fill interconnect features on the substrate with an ECP process on a single substrate processing platform. Other aspects provide a method for depositing a seed layer on a substrate, fill interconnect features on a substrate, or sequentially deposit both a seed layer and fill interconnect features on the substrate. One embodiment provides a method for forming a capping layer over substrate interconnects. Methods include the use of a vapor dryer for pre- and post-deposition cleaning of substrates as well as a brush box chamber for post-deposition cleaning.