Brandon Carr Hamilton

US Patent:

8461698, Jun 11, 2013

Filed:

Sep 28, 2010

Appl. No.:

12/892617

Inventors:

Brandon C. Hamilton - Marion IA, US
Alan P. Boone - Swisher IA, US
Guy N. Smith - Cedar Rapids IA, US

Assignee:

Rockwell Collins, Inc. - Cedar Rapids IA

International Classification:

H01L 23/28
H01L 23/34
H05K 1/00

US Classification:

257787, 257723, 257E21502, 257E21503, 257E23116, 361751

Abstract:

An integrated circuit assembly (ex. —a flip chip package, a wire bond chip package) is provided which includes a substrate (ex. —a printed circuit board) and a die assembly. The die assembly includes an integrated circuit chip which is connected to the printed circuit board. Further, an external dielectric layer (ex. —a solder mask layer) of the printed circuit board is at least substantially coated with a conductive coating (ex. —a low sintering temperature, nano-particle silver coating). The conductive coating is not in contact with the die assembly and/or passive electronics which are connected to the printed circuit board, however the conductive coating is electrically connected to the printed circuit board. The conductive coating provides (ex—acts as) an external ground plane for the printed circuit board.

US Patent:

8585937, Nov 19, 2013

Filed:

Jan 26, 2012

Appl. No.:

13/359105

Inventors:

Nathan P. Lower - North Liberty IA, US
Ross K. Wilcoxon - Cedar Rapids IA, US
Alan P. Boone - Swisher IA, US
Nathaniel P. Wyckoff - Cedar Rapids IA, US
Brandon C. Hamilton - Cedar Rapids IA, US

Assignee:

Rockwell Collins, Inc. - Cedar Rapids IA

International Classification:

H01B 1/02
H01B 1/06

US Classification:

2525213, 2525181, 106634, 118300, 118313, 174260, 427 58, 4273762, 428615

Abstract:

A method for forming an embedded passive device module comprises depositing a first amount of an alkali silicate material, co-depositing an amount of embedded passive device material with the amount of alkali silicate material; and thermally processing the amount of alkali silicate material and the amount of embedded passive device material at a temperature sufficient to cure the amount of alkali silicate material and the amount of embedded passive device material and form a substantially moisture free substrate.

US Patent:

20100078605, Apr 1, 2010

Filed:

Sep 29, 2008

Appl. No.:

12/286207

Inventors:

Nathan P. Lower - North Liberty IA, US
Ross K. Wilcoxon - Cedar Rapids IA, US
Alan P. Boone - Swisher IA, US
Nathaniel P. Wyckoff - Cedar Rapids IA, US
Brandon C. Hamilton - Cedar Rapids IA, US

International Classification:

H01B 1/04
B05C 5/00
B05D 5/12

US Classification:

2525213, 118313, 427 992, 427 968

Abstract:

A method for forming an embedded passive device module comprises depositing a first amount of an alkali silicate material, co-depositing an amount of embedded passive device material with the amount of alkali silicate material; and thermally processing the amount of alkali silicate material and the amount of embedded passive device material at a temperature sufficient to cure the amount of alkali silicate material and the amount of embedded passive device material and form a substantially moisture free substrate.

US Patent:

20220180924, Jun 9, 2022

Filed:

Dec 7, 2020

Appl. No.:

17/113329

Inventors:

- Cedar Rapids IA, US
Nathaniel P. Wyckoff - Marion IA, US
Brandon C. Hamilton - Marion IA, US
Bruce Rowenhorst - Marion IA, US
Steven J. Wiebers - Center Point IA, US

Assignee:

Rockwell Collins, Inc. - Cedar Rapids IA

International Classification:

G11C 13/00
H01L 27/24
H01L 45/00

Abstract:

A system may include a multi-lead memristor. The multi-lead memristor may include a first lead, a second lead, a third lead, a first memristor material, and a second memristor material. The second lead may be positioned between the first lead and the third lead. The first memristor material may be positioned between the first lead and the second lead. The second memristor material may be positioned between the second lead and the third lead.

US Patent:

20220181548, Jun 9, 2022

Filed:

Dec 7, 2020

Appl. No.:

17/113406

Inventors:

- Cedar Rapids IA, US
Nathaniel P. Wyckoff - Marion IA, US
Brandon C. Hamilton - Marion IA, US
Bruce Rowenhorst - Marion IA, US
Steven J. Wiebers - Center Point IA, US

Assignee:

Rockwell Collins, Inc. - Cedar Rapids IA

International Classification:

H01L 45/00
H01L 27/24
G11C 13/00

Abstract:

A system may include an array of interconnected memristors. Each memristor may include a first electrode, a second electrode, and a memristor material positioned between the first electrode and the second electrode. The system may further include a controller communicatively coupled to the array of interconnected memristors. The controller may be configured to tune the array of interconnected memristors.