Brian R Bullock

US Patent:

58443193, Dec 1, 1998

Filed:

Mar 3, 1997

Appl. No.:

8/808773

Inventors:

Danniel Roman Gamota - Palatine IL
George Amos Carson - Elk Grove Village IL
Sean Xin Wu - Palatine IL
Brian J. Bullock - Elmhurst IL

Assignee:

Motorola Corporation - Schaumburg IL

International Classification:

H01L 2348
H01L 2352
H01L 2940

US Classification:

257778

Abstract:

A microelectronic assembly (10) includes an integrated circuit component (14) attached to a polymeric substrate (12) by a plurality of unencapsulated solder bump interconnections (16). A collar (18) is affixed to the polymeric substrate (12) about the integrated circuit component (14) and is formed of an inorganic material having a coefficient of thermal expansion less than that of the substrate (12). The collar (18) constrains thermal expansion of the polymeric substrate (12) in the die attach region (22), thereby lessening any deleterious effects caused by a mismatch in the thermal expansion of the polymeric substrate (12) and the integrated circuit component (14).

US Patent:

60023228, Dec 14, 1999

Filed:

May 5, 1998

Appl. No.:

9/072964

Inventors:

David J. Krueger - Arlington Heights IL
Brian J. Bullock - Elmhurst IL
Honorio S. Luciano - Elk Grove Village IL

Assignee:

Littelfuse, Inc. - Des Plaines IL

International Classification:

H01H 85046
H01H 8520
H01H 6902

US Classification:

337297

Abstract:

A thin film, surface-mounted fuse which comprises two material subassemblies. The first subassembly comprises a fusible link, its supporting substrate and terminal pads. The second subassembly comprises a protective, photoimageable layer which overlies the fusible link so as to provide protection from impacts and oxidation. The photoimageable layer is a low profile coating.

US Patent:

D2931052, Dec 8, 1987

Filed:

Mar 10, 1986

Appl. No.:

6/842413

Inventors:

Brian P. Bullock - Chicago IL
Howard J. Morrison - Deerfield IL

Assignee:

Marvin Glass & Associates - Chicago IL

US Classification:

D14 53

US Patent:

D2931028, Dec 8, 1987

Filed:

Mar 10, 1986

Appl. No.:

6/842412

Inventors:

Brian P. Bullock - Chicago IL
Howard J. Morrison - Deerfield IL

Assignee:

Marvin Glass & Associates - Chicago IL

US Classification:

D14 53

US Patent:

D315777, Jun 13, 1989

Filed:

Dec 28, 1987

Appl. No.:

7/138020

Inventors:

Howard J. Morrison - Riverwoods IL
Brian P. Bullock - Chicago IL

Assignee:

Marvin Glass & Associates - Chicago IL

US Classification:

D14 53