Brian E Collins

US Patent:

7649209, Jan 19, 2010

Filed:

Apr 24, 2007

Appl. No.:

11/739307

Inventors:

Christopher P. Hussell - Cary NC, US
Michael J. Bergmann - Chapel Hill NC, US
Brian T. Collins - Raleigh NC, US
David T. Emerson - Chapel Hill NC, US

Assignee:

Cree, Inc. - Durham NC

International Classification:

H01L 33/00

US Classification:

257 98, 257 99, 257E33061

Abstract:

A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.

US Patent:

7910938, Mar 22, 2011

Filed:

Aug 16, 2007

Appl. No.:

11/839603

Inventors:

Christopher P. Hussell - Cary NC, US
Michael J. Bergmann - Chapel Hill NC, US
Brian T. Collins - Raleigh NC, US
David T. Emerson - Chapel Hill NC, US

Assignee:

Cree, Inc. - Durham NC

International Classification:

H01L 33/48

US Classification:

257 98, 257100, 257E33055, 257E33059, 257E33067

Abstract:

A light emitting packaged diode ids disclosed that includes a light emitting diode mounted in a reflective package in which the surfaces adjacent the diode are near-Lambertian reflectors. An encapsulant in the package is bordered by the Lambertian reflectors and a phosphor in the encapsulant converts frequencies emitted by the LED chip and, together with the frequencies emitted by the LED chip, produces white light. A substantially flat meniscus formed by the encapsulant defines the emitting surface of the packaged diode.

US Patent:

8287759, Oct 16, 2012

Filed:

May 15, 2009

Appl. No.:

12/466782

Inventors:

Brian Thomas Collins - Holly Springs NC, US
Jesse Colin Reiherzer - Raleigh NC, US
Florin A. Tudorica - Durham NC, US

Assignee:

Cree, Inc. - Durham NC

International Classification:

C09K 11/08
C09K 11/55
C09K 11/59
C09K 11/64
C09K 11/65
C09K 11/79
C09K 11/80

US Classification:

2523014R, 2523014 F, 2523016 R

Abstract:

A luminescent particle includes an interior portion of the luminescent particle comprising a luminescent compound that reacts with atmospherically present components and a passivating layer on an outer surface of the luminescent particle that is operable to inhibit the reaction between the luminescent compound and the atmospherically present components.

US Patent:

8362512, Jan 29, 2013

Filed:

Dec 11, 2009

Appl. No.:

12/635818

Inventors:

Christopher P. Hussell - Cary NC, US
Michael J. Bergmann - Chapel Hill NC, US
Brian T. Collins - Holly Springs NC, US
David T. Emerson - Chapel Hill NC, US

Assignee:

Cree, Inc. - Durham NC

International Classification:

H01L 33/00

US Classification:

257 99, 257 81, 257 98, 257100, 345 82

Abstract:

A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.

US Patent:

8390022, Mar 5, 2013

Filed:

Jan 10, 2012

Appl. No.:

13/347243

Inventors:

Christopher P. Hussell - Cary NC, US
Michael J. Bergmann - Chapel Hill NC, US
Brian T. Collins - Raleigh NC, US
David T. Emerson - Chapel Hill NC, US

Assignee:

Cree, Inc. - Durham NC

International Classification:

H01L 33/00

US Classification:

257 99, 257E33059, 257E33054

Abstract:

A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.

US Patent:

8425271, Apr 23, 2013

Filed:

Aug 16, 2007

Appl. No.:

11/839562

Inventors:

Christopher P. Hussell - Cary NC, US
Michael J. Bergmann - Chapel Hill NC, US
Brian T. Collins - Raleigh NC, US
David T. Emerson - Chapel Hill NC, US

Assignee:

Cree, Inc. - Durham NC

International Classification:

H01J 9/00
H01J 9/24

US Classification:

445 23, 445 22, 445 58, 313498, 313499, 313501, 313502, 313512

Abstract:

A method of forming an LED lamp with a desired distribution of phosphor is disclosed. The method includes the steps of mixing a plurality of phosphor particles in an uncured polymer resin for which the viscosity can be controlled in response to temperature to form a substantially uniform suspension of the phosphor particles in the resin. The uncured resin is then placed into a defined position adjacent an LED chip and the temperature of the resin is increased to correspondingly decrease its viscosity but to less than the temperature at which the resin would cure unreasonably quickly. The phosphor particles are encouraged to settle in the lowered-viscosity resin to a desired position with respect to the LED chip, and the temperature of the resin is thereafter increased to the point at which it will cured and solidify.

US Patent:

8487337, Jul 16, 2013

Filed:

Mar 14, 2011

Appl. No.:

13/046982

Inventors:

Christopher P. Hussell - Cary NC, US
Michael J. Bergmann - Chapel Hill NC, US
Brian T. Collins - Raleigh NC, US
David T. Emerson - Chapel Hill NC, US

Assignee:

Cree, Inc. - Durham NC

International Classification:

H01L 33/00

US Classification:

257 99, 257E33059, 257E33054

Abstract:

A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.

US Patent:

8547009, Oct 1, 2013

Filed:

Jul 10, 2009

Appl. No.:

12/500679

Inventors:

Christopher P. Hussell - Cary NC, US
Brian Collins - Holly Springs NC, US

Assignee:

Cree, Inc. - Durham NC

International Classification:

H01J 1/62
H01L 33/00

US Classification:

313499, 313501, 313502, 257 98

Abstract:

A lighting structure may include a semiconductor light emitting device configured to generate light responsive to an electrical signal applied thereto. In addition, an encapsulating material may be configured to transmit light generated by the semiconductor light emitting device, and the encapsulating material may include yttrium aluminum garnet (YAG) diffuser particles and phosphor particles therein. More particularly, the yttrium aluminum garnet (YAG) diffuser particles and the phosphor particles may have different compositions.