Brian W Jacobs

US Patent:

48211478, Apr 11, 1989

Filed:

Oct 5, 1987

Appl. No.:

7/105637

Inventors:

Brian Jacobs - Palo Alto CA
Thomas McGaffigan - Half Moon Bay CA
Edward Cydzik - Foster City CA

Assignee:

Raychem Corporation - Menlo Park CA

International Classification:

H05K 720

US Classification:

361388

Abstract:

The invention provides a mounting assembly comprising an electronic module and a rack for receiving the module. The assembly includes an actuator arranged to cause the module to slide along the rack into engagement with an end stop, and subsequently to actuate means arranged to force a surface of the module against a surface of the rack, for example to make a heat sink link. The actuator preferably comprises a shape memory alloy element.

US Patent:

50601130, Oct 22, 1991

Filed:

Jul 31, 1990

Appl. No.:

7/561228

Inventors:

Brian Jacobs - Palo Alto CA

Assignee:

Raychem Corporation - Menlo Park CA

International Classification:

H05K 720

US Classification:

361386

Abstract:

This invention provides a connector assembly for forming electrical connections to at least two circuit boards disposed in a parallel surface-to-surface relationship. The assembly comprises at least two modules, each of which comprises connector elements. A first set of connector elements provides connections between the circuit board and another electrical device, and a second set of connector elements provides connections between the circuit boards. A heat sink may be provided between the circuit boards. Electronic components on the circuit boards may be sealed by means of a gel, which can also serve to transmit heat from the components.