Brian J Marshall

US Patent:

6458290, Oct 1, 2002

Filed:

Aug 21, 2000

Appl. No.:

09/642682

Inventors:

Brian K. Marshall - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

C09K 1300

US Classification:

252 791, 252 794

Abstract:

The present invention provides fluid compositions for use in the planarization of a substrate surface. Fluid compositions include a planarization slurry having an abrasive component and a chemically interactive component and an effective amount of at least one crown ether that is capable of isolating at least one charged ion contaminant specie in the planarization slurry. Also included are fluid compositions that are pre-treated with an effective amount of at least one crown ether to remove one or more charged ion contaminants in the fluid composition utilized in a planarization process. Methods of using the fluid compositions are also provided.

US Patent:

6468909, Oct 22, 2002

Filed:

Sep 3, 1998

Appl. No.:

09/146299

Inventors:

Brian K. Marshall - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

H01L 21302

US Classification:

438691, 438692, 438693, 438694, 438700

Abstract:

The present invention provides fluid compositions for use in the planarization of a substrate surface. Fluid compositions include a planarization slurry having an abrasive component and a chemically interactive component and an effective amount of at least one crown ether that is capable of isolating at least one charged ion contaminant specie in the planarization slurry. Also included are fluid compositions that are pre-treated with an effective amount of at least one crown ether to remove one or more charged ion contaminants in the fluid composition utilized in a planarization process. Methods of using the fluid compositions are also provided.

US Patent:

6520834, Feb 18, 2003

Filed:

Aug 9, 2000

Appl. No.:

09/634057

Inventors:

Brian Marshall - Boise ID

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B24B 4900

US Classification:

451 5, 451 10, 451 9, 451 41, 451 59, 451288, 451550

Abstract:

Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table, a carrier assembly, and an array of force sensors embedded in at least one of the planarizing pad, a sub-pad under the planarizing pad, or the table. The force sensor array can include shear and/or normal force sensors, and can be configured in a grid pattern, concentric pattern, radial pattern, or a combination thereof. Analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates includes removing material from the microelectronic substrate by pressing the substrate against a planarizing surface, determining a force distribution exerted against the substrate by sensing a plurality of forces at a plurality of discrete nodes as the substrate rubs against the planarizing surface, and controlling a planarizing parameter of a planarizing cycle according to the determined force distribution. A planarizing pad or sub-pad for mechanical or chemical-mechanical planarization in accordance with an embodiment of the invention can include a body having a plurality of raised portions and a plurality of low regions between the raised portions, and a plurality of force sensors embedded in the body at locations relative to the raised portions. Positioning the sensors relative to the raised portion can isolate shear and/or normal forces exerted against the pad by the microelectronic substrate during planarization.

US Patent:

6974364, Dec 13, 2005

Filed:

Dec 31, 2002

Appl. No.:

10/334424

Inventors:

Brian Marshall - Boise ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B24B049/00
B24B051/00

US Classification:

451 8, 451 9, 451288, 451533, 451550

Abstract:

Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table, a carrier assembly, and an array of force sensors embedded in at least one of the planarizing pad, a sub-pad under the planarizing pad, or the table. The force sensor array can include shear and/or normal force sensors, and can be configured in a grid pattern, concentric pattern, radial pattern, or a combination thereof. Analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates includes removing material from the microelectronic substrate by pressing the substrate against a planarizing surface, determining a force distribution exerted against the substrate by sensing a plurality of forces at a plurality of discrete nodes as the substrate rubs against the planarizing surface, and controlling a planarizing parameter of a planarizing cycle according to the determined force distribution. A planarizing pad or sub-pad for mechanical or chemical-mechanical planarization in accordance with an embodiment of the invention can include a body having a plurality of raised portions and a plurality of low regions between the raised portions, and a plurality of force sensors embedded in the body at locations relative to the raised portions. Positioning the sensors relative to the raised portion can isolate shear and/or normal forces exerted against the pad by the microelectronic substrate during planarization.

US Patent:

7182668, Feb 27, 2007

Filed:

Dec 13, 2005

Appl. No.:

11/301575

Inventors:

Brian Marshall - Boise ID, US

Assignee:

Micron Technology, Inc. - Boise ID

International Classification:

B24B 49/00
B24B 51/00

US Classification:

451 5, 451 9, 451 10, 451 41, 451 59, 451288, 451550

Abstract:

Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table, a carrier assembly, and an array of force sensors embedded in at least one of the planarizing pad, a sub-pad under the planarizing pad, or the table. The force sensor array can include shear and/or normal force sensors, and can be configured in a grid pattern, concentric pattern, radial pattern, or a combination thereof. Analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates includes removing material from the microelectronic substrate by pressing the substrate against a planarizing surface, determining a force distribution exerted against the substrate by sensing a plurality of forces at a plurality of discrete nodes as the substrate rubs against the planarizing surface, and controlling a planarizing parameter of a planarizing cycle according to the determined force distribution. A planarizing pad or sub-pad for mechanical or chemical-mechanical planarization in accordance with an embodiment of the invention can include a body having a plurality of raised portions and a plurality of low regions between the raised portions, and a plurality of force sensors embedded in the body at locations relative to the raised portions. Positioning the sensors relative to the raised portion can isolate shear and/or normal forces exerted against the pad by the microelectronic substrate during planarization.

US Patent:

20120047479, Feb 23, 2012

Filed:

Mar 9, 2008

Appl. No.:

12/530453

Inventors:

James M. Paris - Portland OR, US
Brian Marshall - Wilsonville OR, US
John G. Ferguson - Tualatin OR, US
Anant S. Adke - Lake Oswego OR, US

International Classification:

G06F 17/50

US Classification:

716112

Abstract:

Techniques for incrementally analyzing layout design data are disclose. With various implementations, a subsequent incremental analysis can be made for only portions of layout design data, using a subset of available analysis criteria, or some combination of both. For example, the analysis can be limited to errors identified in a previous analysis process, to changes in the layout design data made after a previous analysis process, to particular areas specified by a designer, or some combination thereof. Still further, the analysis process may be performed using only a subset of analysis criteria relevant to the portions of the design data being analyzed, a subset of the initial analysis criteria that the design data failed in a previous analysis process, a subset of the initial analysis criteria selected by the designer, or some combination thereof. Further, such an incremental analysis process can be initiated before a previous analysis process has completed.