Bruno S Samuel

US Patent:

7880287, Feb 1, 2011

Filed:

Aug 7, 2009

Appl. No.:

12/537957

Inventors:

Bruno Samuel - Apopka FL, US
Charles Carpenter - Orlando FL, US
John Beall - Richardson TX, US
Justin Everman - Richardson TX, US
Benne Velsher - Plano TX, US

Assignee:

TriQuint Semiconductor, Inc. - Hillsboro OR

International Classification:

H01L 23/495

US Classification:

257692, 257737, 257E23031, 438123

Abstract:

Embodiments include but are not limited to apparatuses and systems including a package having stud bumps for die alignment. A package may include a package substrate, and a plurality of stud bumps coupled to the package substrate. The stud bumps may define a die region of the package substrate in which movement of a die disposed within the die region is restricted prior to attachment of the die to the package substrate, wherein the plurality of stud bumps comprise a profile that is less than a profile of the die when attached to the package substrate. Other embodiments may be described.