Dennis A. Thompson - Scottsville NY Bryan L. Howe - Honeoye Falls NY
Assignee:
Eastman Kodak Company - Rochester NY
International Classification:
H01J 37304
US Classification:
2504923
Abstract:
A product and process for making backside thinned semiconductor image sensing devices employing neutral ion beams to reduce substrate volumes so that the image sensor can be illuminated from the backside, or side opposite etched circuitry. A neutral ion beam is contained in a vacuum chamber that has a fixture for holding a semiconductor image sensor, a control mechanism for controlling the neutral ion beam via the raster mechanism, and a map of the semiconductor image sensor. The image sensor is placed on the fixture within the vacuum chamber and the neutral ion beam removes a predetermined amount of substrate from the backside of the sensor. The result is an image sensor than can be backside thinned at the molecular level.
Dennis A. Thompson - Scottsville NY Bryan L. Howe - Honeoye Falls NY
Assignee:
Eastman Kodak Company - Rochester NY
International Classification:
H01L 2100 H01L 21339 H01L 2130
US Classification:
438 60
Abstract:
A product and process for making backside inned semiconductor image sensing devices employing neutral ion beams to reduce substrate volumes so that the image sensor can be illuminated from the backside, or side opposite etched circuitry. A neutral ion beam is contained in a vacuum chamber that has a fixture for holding a semiconductor image sensor, a control mechanism for controlling the neutral ion beam via the raster mechanism, and a map of the semiconductor image sensor. The image sensor is placed on the fixture within the vacuum chamber and the neutral ion beam removes a predetermined amount of substrate from the backside of the sensor. The result is an image sensor than can be backside thinned at the molecular level.
Harris Corporation
Senior Program and Project Manager
University at Buffalo Sep 1980 - Dec 1981
Instructor and Graduate Assistant
Fca Fiat Chrysler Automobiles Jul 1979 - Jul 1980
Product Development Engineer
Education:
University at Buffalo 1980 - 1981
Master of Science, Masters, Mechanical Engineering
Monroe Community College 1975 - 1979
University at Buffalo 1977 - 1979
Bachelors, Bachelor of Science, Mechanical Engineering
Skills:
Aerospace Engineering Management Earned Value Management Engineering Systems Engineering Program Management Product Development Six Sigma Sensors System Design Cross Functional Team Leadership Systems Design Security Clearance Dod Manufacturing Lean Manufacturing Requirements Management Root Cause Analysis Continuous Improvement Design For Manufacturing Mechanical Engineering Pro Engineer Solidworks Simulations Gd&T Fmea Finite Element Analysis Testing
Systems Design Engineering Sensors Earned Value Management Program Management Testing Systems Engineering Engineering Management Aerospace Manufacturing Space Systems Six Sigma Cross Functional Team Leadership