Bryan D Root

US Patent:

20200341055, Oct 29, 2020

Filed:

Apr 13, 2020

Appl. No.:

16/847111

Inventors:

- Burnsville MN, US
William A. FUNK - Lakeville MN, US
Bryan J. ROOT - Apple Valley MN, US

International Classification:

G01R 31/28
B23Q 1/00

Abstract:

The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

US Patent:

20200110126, Apr 9, 2020

Filed:

Oct 7, 2019

Appl. No.:

16/594443

Inventors:

- Burnsville MN, US
William A. FUNK - Lakeville MN, US
Bryan J. ROOT - Apple Valley MN, US

International Classification:

G01R 31/26
G01R 1/073
G01R 31/28
G01R 1/44

Abstract:

A test assembly for testing a device under test includes a probe card assembly and a cap secured to the probe card assembly. The probe card assembly includes a probe tile having a plurality of openings. The probe tile includes a plurality of probe wires including a probe needle portion and a probe tip portion. A seal is disposed on a surface of the probe tile and forms an outer perimeter of a pressurized area. The probe tile includes an insulation layer formed within the pressurized area that is configured to separate the probe needle portion from the device under test. The insulation layer includes an aperture through which the probe tip portion extends to contact the device under test. The cap includes a fluid inlet and a fluid return outlet that are in fluid communication with the plurality of openings of the probe tile.

US Patent:

20190235018, Aug 1, 2019

Filed:

Apr 12, 2019

Appl. No.:

16/383257

Inventors:

- Burnsville MN, US
William A. FUNK - Lakeville MN, US
Bryan J. ROOT - Apple Valley MN, US

International Classification:

G01R 31/28
B23Q 1/00

Abstract:

The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

US Patent:

20190011498, Jan 10, 2019

Filed:

Dec 28, 2016

Appl. No.:

16/066990

Inventors:

- Burnsville MN, US
William A. FUNK - Lakeville MN, US
Bryan J. ROOT - Apple Valley MN, US

International Classification:

G01R 31/28

Abstract:

The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

US Patent:

20160320428, Nov 3, 2016

Filed:

Dec 31, 2014

Appl. No.:

15/108237

Inventors:

- Apple Valley MN, US
William A. FUNK - Lakeville MN, US
Bryan J. ROOT - Apple Valley MN, US

International Classification:

G01R 1/067
G01R 31/28

Abstract:

A latch assembly that can lock and unlock a probe core with respect to a circuit board is provided. The latch assembly can engage with the probe core to align the probe core with respect to a circuit board, and press down the probe core against the circuit board by rotating to lock the probe core with the circuit board. An installation tool is provided to grip or release the probe core to/from a latch assembly or a probe core carrier. The installation tool can align with the probe core and/or the latch assembly to lock and unlock the probe core with respect to a circuit board.