Bum S Kim

US Patent:

20220305613, Sep 29, 2022

Filed:

Feb 16, 2022

Appl. No.:

17/673511

Inventors:

- Santa Clara CA, US
Bum Jick Kim - Irvine CA, US
Jay Gurusamy - Santa Clara CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B24B 37/26

Abstract:

Chemical-mechanical polishing assemblies may include an upper platen characterized by a first surface and a second surface opposite the first surface. The upper platen may define a recess in the second surface of the upper platen. The upper platen may define a flexure between the first surface and the second surface within the recess. The assemblies may include a polishing pad coupled with the first surface of the upper platen. The assemblies may include a plate coupled with the upper platen along the second surface of the upper platen. The plate may define a volume within the recess of the upper platen between the second surface of the upper platen and the plate.

US Patent:

20160114459, Apr 28, 2016

Filed:

Oct 24, 2014

Appl. No.:

14/523482

Inventors:

- Santa Clara CA, US
Bum Jick KIM - Irvine CA, US

International Classification:

B24B 53/017

Abstract:

Polishing pad cleaning systems employing fluid outlets orientated to direct fluid under spray bodies and towards inlet ports, and related methods are disclosed. A polishing pad in combination with slurry contacts a substrate to planarize a surface of the substrate and remove substrate defects while creating debris. A spray system removes the debris from the polishing pad to prevent substrate damage and improve efficiency. By directing fluid under a spray body to the polishing pad and towards an inlet port, the debris may be entrained in the fluid and directed to an inner plenum of the spray body. The fluid-entrained debris is subsequently removed from the inner plenum through an outlet port. In this manner, the debris removal may reduce substrate defects, improve facility cleanliness, and improve pad efficiency.