Byron C Sakiadis

US Patent:

48752797, Oct 24, 1989

Filed:

Feb 22, 1988

Appl. No.:

7/158729

Inventors:

Byron C. Sakiadis - Chadds Ford PA

Assignee:

E. I. Du Pont de Nemours and Company - Wilmington DE

International Classification:

H05K 1304

US Classification:

29740

Abstract:

Die attach pickup tools for relocating a flexible die attach. The pickup tools comprise a head portion connected to an end portion. The head portions have a face for contacting a die attach and at least one hole in the face. Passage means extend from the hole(s) through the tool for connection to a vacuum source.

US Patent:

52960749, Mar 22, 1994

Filed:

Feb 1, 1993

Appl. No.:

8/013230

Inventors:

William F. Graham - Landenberg PA
Mel A. Lofurno - Kennett Square PA
Byron C. Sakiadis - Chadds Ford PA

Assignee:

E. I. Du Pont de Nemours and Company - Wilmington DE

International Classification:

B32B 3100

US Classification:

1563099

Abstract:

A method for rapidly bonding a small electronic component to a mating surface of a high surface energy substrate using an adhesive pad made from a substantially amorphous, solvent-free thermoplastic polymer.