Calvin Chen

US Patent:

20210256518, Aug 19, 2021

Filed:

May 4, 2021

Appl. No.:

17/307861

Inventors:

- San Francisco CA, US
Shalini Mayor - Foster City CA, US
Calvin Chen - Fremont CA, US

International Classification:

G06Q 20/40
G06Q 20/38

Abstract:

Embodiments are directed to the generation of a token associated with a status. The status of the token may affect how the token is treated and the types of restrictions placed on the token. The status of the token may indicate that the token is generated based on verification of secure user data. Alternatively, the status of the token may indicate that the token is generated based on insufficient user data and, as such, restrictions may be imposed on the token. The token requestor may be a mobile application, such as a merchant mobile application provisioned on a user device. In response to a token request from the merchant, the token provider issues tokens with varying status based on a confidence level. The status of the token may be indicated in terms of token assurance level.

US Patent:

20200232098, Jul 23, 2020

Filed:

Jan 21, 2020

Appl. No.:

16/748335

Inventors:

- Santa Clara CA, US
Sunity K. SHARMA - Fremont CA, US
Shinichi IKETANI - Sunnyvale CA, US
Calvin CHEN - Daly City CA, US
Shalaka RAHANGDALE - Morrisville NC, US

International Classification:

C23C 18/18
H05K 3/04
H05K 3/02
C23C 18/16

Abstract:

Methods of patterning electroless metals on a substrate are presented. The substrate is covered by a blocking reagent. After formation of a catalyst blocking layer on the substrate, portions of the catalyst blocking layer are removed to form a circuit pattern. A catalyst is placed the surfaces of both the catalyst blocking layer and the exposed substrate. The catalyst blocking layer prevents or reduces catalytic activity of the catalyst. Electroless metal plating is performed to plate a metal at the active portions of the catalyst.

US Patent:

20200190670, Jun 18, 2020

Filed:

Dec 13, 2019

Appl. No.:

16/714036

Inventors:

- Santa Clara CA, US
Calvin CHEN - Daly City CA, US
Shinichi IKETANI - Sunnyvale CA, US
Michael Riley VINSON - Sunnyvale CA, US

International Classification:

C23C 18/44
C09D 11/037
C09D 11/033
C23C 18/40

Abstract:

Devices, systems, and methods are contemplated for depositing metals to the surface of a substrate. A first precursor ink including a metal is applied to a surface of the substrate, and the precursor ink is reduced to deposit the metal to the substrate, preferably by thermal reduction, forming a first metal layer. A second precursor ink having a second metal is then applied to the substrate, at least partially over the first metal layer. The second precursor ink is then reduced, typically by chemical reduction, depositing the second metal over the first metal layer in a globular fashion. Precursor inks are also disclosed having an alkyl metal carboxylate, a cyclic amine, and at least one of an ester, a hydrocarbon, or an ether.

US Patent:

20190152002, May 23, 2019

Filed:

Nov 20, 2018

Appl. No.:

16/196754

Inventors:

- Santa Clara CA, US
Calvin CHEN - Daly City CA, US
Divyakant P KADIWALA - Fremont CA, US
Sunity K. SHARMA - Fremont CA, US

International Classification:

B23K 35/362

Abstract:

Compositions and methods for coupling metals to aluminum surfaces are provided. The compositions are prepared as aqueous solutions or suspensions, and can be applied to the aluminum surface using conventional printing techniques. Rheology of the printable composition can be adjusted to provide a gel or a cream. Curing steps, if necessary, are performed at low temperatures that are compatible with plastic/polymer components of mass produced devices, such as aluminum RFID antennae.