Carl W Cook

US Patent:

47302380, Mar 8, 1988

Filed:

Oct 1, 1986

Appl. No.:

6/914094

Inventors:

Carl R. Cook - Coral Springs FL

Assignee:

Gould Inc. - Rolling Meadows IL

International Classification:

H05K 111

US Classification:

361414

Abstract:

A multiple layer connection system for compactly connecting a plurality of surface mount integrated circuit packages to a printed circuit board is disclosed. A plurality of staggered metal legs is respectively inserted into a plurality of slots formed along an edge of an intermediate plastic sheet. A first outside sheet and a second outside sheet sandwich the intermediate sheet between themselves. The first outside sheet has a plurality of foil conductors formed on an inside layer thereof to connect with a first portion of the staggered legs. A plurality of feed through holes are in electrical connection with the first conductive traces and with a plurality of first outside foil traces which are connectable by soldering to the legs of a surface mount integrated circuit package. A second plurality of inside foil traces is formed on an inside layer of the second plastic sheet and contacts a second group of the legs. A second plurality of feed through holes connects the second plurality of inside foil to a second plurality of outside foil traces formed on an outside layer of the second sheet.