Carl J Ross

US Patent:

6608370, Aug 19, 2003

Filed:

Jan 28, 2002

Appl. No.:

10/058557

Inventors:

Shiuh-Hui Steven Chen - Lake Zurich IL
Raymond Garza - Huntley IL
Carl Ross - Mundelein IL
Stefan Turalski - Chicago IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 23495

US Classification:

257678, 257668, 206710, 206711, 206714

Abstract:

A semiconductor wafer ( ) that includes a support body ( ), at least one thin die ( ), and a plurality of tethers ( ). The support body ( ) is made of a semiconductor material. The thin die ( ) has a circuit ( ) formed thereon and has an outer perimeter ( ) defined by an open trench ( ). The open trench ( ) separates the thin die ( ) from the support body ( ). The tethers ( ) extend across the open trench ( ) and between the support body ( ) and the thin die ( ). A method of making a thin die ( ) on a wafer ( ) where the wafer ( ) has a support body ( ), a topside ( ) and a backside ( ). A circuit ( ) is formed on the topside ( ) of the wafer ( ). The method may include the steps of: forming a cavity ( ) on the backside ( ) of the wafer ( ) beneath the circuit ( ) that defines a first layer ( ) that includes the circuit ( ); forming a trench ( ) around the circuit ( ) on the topside ( ) of the wafer ( ) that defines an outer perimeter ( ) of the thin die ( ); forming a plurality of tethers ( ) that extend across the trench ( ) and between the wafer support body ( ) and the thin die ( ); and removing a portion of the first layer ( ) to define the bottom surface ( ) of the thin die ( ).

US Patent:

6881648, Apr 19, 2005

Filed:

Mar 13, 2003

Appl. No.:

10/387754

Inventors:

Shiuh-Hui Steven Chen - Lake Zurich IL, US
Raymond Garza - Huntley IL, US
Carl Ross - Mundelein IL, US
Stefan Turalski - Chicago IL, US

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L021/46

US Classification:

438459, 438455, 438456, 438977

Abstract:

A semiconductor wafer () that includes a support body (), at least one thin die (), and a plurality of tethers (). The support body () is made of a semiconductor material. The thin die () has a circuit () formed thereon and has an outer perimeter () defined by an open trench (). The open trench () separates the thin die () from the support body (). The tethers () extend across the open trench () and between the support body () and the thin die (). A method of making a thin die () on a wafer () where the wafer () has a support body (), a topside () and a backside (). A circuit () is formed on the topside () of the wafer (). The method may include the steps of: forming a cavity () on the backside () of the wafer () beneath the circuit () that defines a first layer () that includes the circuit (); forming a trench () around the circuit () on the topside () of the wafer () that defines an outer perimeter () of the thin die (); forming a plurality of tethers () that extend across the trench () and between the wafer support body () and the thin die (); and removing a portion of the first layer () to define the bottom surface () of the thin die ().

US Patent:

7009124, Mar 7, 2006

Filed:

May 13, 2004

Appl. No.:

10/845381

Inventors:

Shiuh-Hui Steven Chen - Lake Zurich IL, US
Carl A. Ross - Mundelein IL, US

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01H 35/02

US Classification:

200 6145R, 200 6145 M

Abstract:

An acceleration switch and method therefor includes providing a conductive substrate and an insulating cap. A recessed area is formed in the insulating cap. An insulating layer is disposed on the conductive substrate. A conductive layer is disposed on the insulating layer. The conductive layer is etched to form a cantilever beam and an electrically isolated island. The insulating layer is etched around the cantilever beam to free the cantilever beam to move. Contacts are disposed on the cantilever beam and in the recessed area such that the contacts are able to electrically contact each other upon application of an acceleration to the switch. The cap is bonded to the conductive layer to hermetically seal the cantilever beam.

US Patent:

61420212, Nov 7, 2000

Filed:

Aug 21, 1998

Appl. No.:

9/137765

Inventors:

Carl Ross - Mundelein IL
Walter Czarnocki - Hoffman Estates IL
John Schuster - Grayslake IL
Xiaoyi Ding - Lake Zurich IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G01L 906

US Classification:

73727

Abstract:

A sensor (10) includes a plurality of sensing elements (14-20) deposed on a sensor substrate (12) and an electronic switching circuit (22) electrically connected to each of the sensing elements (14-20) for electrically selecting at least one of the sensing elements (14-20).

US Patent:

56000723, Feb 4, 1997

Filed:

Jun 23, 1995

Appl. No.:

8/494127

Inventors:

Shiuh-Hui S. Chen - Lake Zurich IL
Carl Ross - Mundelein IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G01L 912

US Classification:

73724

Abstract:

A sensor (44) having all electrical connection formed on one of the sensor's sides. A first substrate (10) operably attached to a second substrate (32) where the second substrate includes at least one feedthrough hole (22). A first electrical connection (36) is formed on the first substrate (10) through the feedthrough hole (22). A second electrical connection (38) is formed on the second substrate (32) such that the first and second electrical connections (36, 38) are formed on the same side of the sensor (44). An electrical insulator (26) is disposed between the second substrate (32) and the first electrical connection (36) to electrically isolate the first electrical connection (36) from the second substrate (32).

US Patent:

53657900, Nov 22, 1994

Filed:

Apr 2, 1992

Appl. No.:

7/862142

Inventors:

Shiuh-Hui Chen - Lake Zurich IL
Carl Ross - Mundelein IL
Roseann M. Tomasello - Mundelein IL
Anita G. Brandes - Arlington Heights IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G01L 912

US Classification:

73724

Abstract:

A device with bonded and conductive substrates is disclosed. This device includes a conductive substrate (509) having an electrically insulating layer (515) disposed on a portion thereon. An electrically conductive layer (519) is disposed on the electrically insulating layer (515). Then an insulating substrate (101) having a first surface (103) and an opposing second surface (105) with an electrically conductive coating (516) disposed on a portion thereon is provided. Finally, the insulating substrate (101) is bonded to the electrically conductive layer (519). In a more specific embodiment a capacitive pressure sensor is disclosed. This capacitive pressure sensor has a sealed chamber (125) and is further constructed with a conductive substrate (509) having an electrically insulating layer (515) disposed thereon. Further, an electrically conductive layer (519) is located on the electrically insulating layer (515) and an insulating substrate (101) having an electrically conductive coating (516) disposed thereon is bonded to the electrically conductive layer (519). Conductive feedthrough passageways (107, 109) are provided so that a measurement circuit may be electrically connected to the capacitive pressure sensor.