Chad C Yau from 3729 Heron Way, Palo Alto, CA 94303, age 77, Phone: 4073977611

Name / Title

Company / Classification

Phones & Addresses

Chad Yau
President, Owner, CEO

QUADRANT COMPONENTS, INC
Whol Computers/Peripherals Mfg Electronic Components · Other Electronic Component Manufacturing · Electronic Computer Mfg · Computers-Electronic-Manufactu

46567 Fremont Blvd, Fremont, CA 94538
4378 Enterprise St, Fremont, CA 94538
5106569988, 5106562208

Chad Yau
President

Envision Peripherals, Inc
Electrical/Electronic Manufacturing · Whol Computers/Peripherals Mfg Computer Peripheral Equipment · Other Computer Peripheral Equipment Manufacturing · Electroplating, Plating, Polishing, Anodizing, and Coloring

47490 Seabridge Dr, Fremont, CA 94538
5107709988

Chad C. Yau
President

SAMPSON ELECTRONICS, INC

4378 Enterprise St, Fremont, CA 94538

Us Patents

Method For Stacking Semiconductor Package Units And Stacked Package
view source
US Patent:

20030164539, Sep 4, 2003
Filed:

Mar 1, 2002
Appl. No.:

10/087414
Inventors:

Chad Yau - Saratoga CA, US
Assignee:

SAMPSON TAIWAN LTD.
International Classification:

H01L023/02
US Classification:

257/686000, 257/777000
Abstract:

A stacked package of semiconductor packaging units includes a direct electrical connection between leads of an upper semiconductor package unit, and includes direct electrical connections between selected leads of the upper semiconductor package unit and a lower semiconductor package unit. Leads of the upper semiconductor package unit are straightened, and chip-select and clock-enable leads are shortened and electrically connected to adjacent not-connected leads. Selected leads of the upper semiconductor package unit are electrically connected directly to underlying leads of the lower semiconductor packaging unit. Electrical connections preferably are solder connections.