Chang Lin

US Patent:

20170207152, Jul 20, 2017

Filed:

Apr 3, 2017

Appl. No.:

15/478064

Inventors:

- Santa Clara CA, US
Lilia May - Chandler AZ, US
Rajen S. Sidhu - Chandler AZ, US
Mukul P. Renavikar - Chandler AZ, US
Ashay A. Dani - Chandler AZ, US
Edward R. Prack - Phoenix AZ, US
Carl L. Deppisch - Chandler AZ, US
Anna M. Prakash - Chandler AZ, US
James C. Matayabas - Gilber AZ, US
Jason Jieping Zhang - Chandler AZ, US
Srinivasa R. Aravamudhan - Beaverton OR, US
Chang Lin - Portland OR, US

International Classification:

H01L 23/498
H01L 23/31
H01L 25/00
H01L 21/48
H01L 21/56
H01L 21/768
H01L 25/065
H01L 23/00

Abstract:

An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.

US Patent:

20150255415, Sep 10, 2015

Filed:

Mar 5, 2014

Appl. No.:

14/198479

Inventors:

Thomas J. De Bonis - Tempe AZ, US
Lilia May - Chandler AZ, US
Rajen S. Sidhu - Chandler AZ, US
Mukul P. Renavikar - Chandler AZ, US
Ashay A. Dani - Chandler AZ, US
Edward R. Prack - Phoenix AZ, US
Carl L. Deppisch - Chandler AZ, US
Anna M. Prakash - Chandler AZ, US
Jason Jieping Zhang - Chandler AZ, US
Srinivasa R. Aravamudhan - Beaverton OR, US
Chang Lin - Portland OR, US

International Classification:

H01L 23/00
H01L 25/065
H01L 23/498
H01L 23/31
H01L 21/56
H01L 21/768

Abstract:

An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.