Charles A Carlson

US Patent:

7357842, Apr 15, 2008

Filed:

Apr 22, 2005

Appl. No.:

11/112281

Inventors:

Tetsuya Ishikawa - Saratoga CA, US
Rick J. Roberts - San Jose CA, US
Helen R. Armer - Cupertino CA, US
Leon Volfovski - Mountain View CA, US
Jay D. Pinson - San Jose CA, US
Michael Rice - Pleasanton CA, US
David H. Quach - San Jose CA, US
Mohsen S. Salek - Saratoga CA, US
Robert Lowrance - Los Gatos CA, US
John A. Backer - San Jose CA, US
William Tyler Weaver - Austin TX, US
Charles Carlson - Cedar Park TX, US
Chongyang Wang - San Jose CA, US
Jeffrey Hudgens - San Francisco CA, US
Harald Herchen - Los Altos CA, US
Brian Lue - Mountain View CA, US

Assignee:

Sokudo Co., Ltd. - Kyoto

International Classification:

B05C 13/02
C23C 14/00
H01L 21/677

US Classification:

118503, 118 50, 41422501, 414217, 414936

Abstract:

A cluster tool for processing a substrate includes a cassette and a processing module including a first processing chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the substrate, and an input chamber. The first processing chamber, the second processing chamber, and the input chamber are substantially adjacent to each other. The processing module also includes a robot that is configured to receive the substrate in the input chamber and transfer and position the substrate in the first processing chamber and second processing chamber. The robot includes a robot blade, an actuator, and a heat exchanging device. The heat exchanging device includes a chilled transfer arm assembly. The cluster tool also includes a 6-axis articulated robot configured to transfer the substrate between the cassette and the input chamber.

US Patent:

7374391, May 20, 2008

Filed:

Dec 22, 2005

Appl. No.:

11/315873

Inventors:

Michael Rice - Pleasanton CA, US
Jeffrey Hudgens - San Francisco CA, US
Charles Carlson - Cedar Park TX, US
William Tyler Weaver - Austin TX, US
Robert Lowrance - Los Gatos CA, US
Eric Englhardt - Palo Alto CA, US
Dean C. Hruzek - Austin TX, US
Mario David Silvetti - Morgan Hill CA, US
Michael Kuchar - Austin TX, US
Kirk Van Katwyk - Tracy CA, US
Van Hoskins - Round Rock TX, US
Vinay Shah - San Mateo CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B25J 15/00

US Classification:

4147448, 2941031

Abstract:

A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool.

US Patent:

7374393, May 20, 2008

Filed:

Apr 5, 2006

Appl. No.:

11/398218

Inventors:

Mike Rice - Pleasanton CA, US
Jeffrey Hudgens - San Francisco CA, US
Charles Carlson - Cedar Park TX, US
William Tyler Weaver - Austin TX, US
Robert Lowrance - Los Gatos CA, US
Eric Englhardt - Palo Alto CA, US
Dean C. Hruzek - Austin TX, US
Mario David Silvetti - Morgan Hill CA, US
Michael Kuchar - Austin TX, US
Kirk Van Katwyk - Tracy CA, US
Van Hoskins - Round Rock TX, US
Vinay Shah - San Mateo CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B65G 61/00

US Classification:

414800, 4147445

Abstract:

A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool.

US Patent:

7651306, Jan 26, 2010

Filed:

Dec 22, 2005

Appl. No.:

11/315984

Inventors:

Mike Rice - Pleasanton CA, US
Jeffrey Hudgens - San Francisco CA, US
Charles Carlson - Cedar Park TX, US
William Tyler Weaver - Austin TX, US
Robert Lowrance - Los Gatos CA, US
Eric Englhardt - Palo Alto CA, US
Dean C. Hruzek - Austin TX, US
Dave Silvetti - Morgan Hill CA, US
Michael Kuchar - Austin TX, US
Kirk Van Katwyk - Tracy CA, US
Van Hoskins - Round Rock TX, US
Vinay Shah - San Mateo CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H01L 21/677

US Classification:

414217, 414935

Abstract:

Embodiments of the invention provide a method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool.

US Patent:

7694647, Apr 13, 2010

Filed:

Jul 19, 2006

Appl. No.:

11/458664

Inventors:

Tetsuya Ishikawa - Saratoga CA, US
Rick J. Roberts - San Jose CA, US
Helen R. Armer - Cupertino CA, US
Leon Volfovski - Mountain View CA, US
Jay D. Pinson - San Jose CA, US
Michael Rice - Pleasanton CA, US
David H. Quach - San Jose CA, US
Mohsen S. Salek - Saratoga CA, US
Robert Lowrance - Los Gatos CA, US
John A. Backer - San Jose CA, US
William Tyler Weaver - Austin TX, US
Charles Carlson - Cedar Park TX, US
Chongyang Wang - San Jose CA, US
Jeffrey Hudgens - San Francisco CA, US
Harald Herchen - Los Altos CA, US
Brian Lue - Mountain View CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B05C 13/02
C23C 14/00
H01L 21/677

US Classification:

118503, 118500, 118 50, 417217, 41722205, 417936

Abstract:

Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e. g. , a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

US Patent:

7743728, Jun 29, 2010

Filed:

Apr 21, 2008

Appl. No.:

12/106824

Inventors:

Tetsuya Ishikawa - Saratoga CA, US
Rick J. Roberts - San Jose CA, US
Helen R. Armer - Cupertino CA, US
Leon Volfovski - Mountain View CA, US
Jay D. Pinson - San Jose CA, US
Michael Rice - Pleasanton CA, US
David H. Quach - San Jose CA, US
Mohsen S. Salek - Saratoga CA, US
Robert Lowrance - Los Gatos CA, US
John A. Backer - San Jose CA, US
William Tyler Weaver - Austin TX, US
Charles Carlson - Cedar Park TX, US
Chongyang Wang - San Jose CA, US
Jeffrey Hudgens - San Francisco CA, US
Harald Herchen - Los Altos CA, US
Brian Lue - Mountain View CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B05C 13/02
C23C 14/00
H01L 21/677

US Classification:

118503, 118500, 118 50, 417217, 41722205, 417936

Abstract:

Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e. g. , a cluster tool). In one embodiment, the cluster tool is adapted to perform a track lithography process in which a photosensitive material is applied to a substrate, patterned in a stepper/scanner, and then removed in a developing process completed in the cluster tool. In one embodiment of the cluster tool, substrates are grouped together in groups of two or more for transfer or processing to improve system throughput, reduce the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, and thus increase system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

US Patent:

7798764, Sep 21, 2010

Filed:

Oct 27, 2006

Appl. No.:

11/553820

Inventors:

Mike Rice - Pleasanton CA, US
Jeffrey Hudgens - San Francisco CA, US
Charles Carlson - Cedar Park TX, US
William Tyler Weaver - Austin TX, US
Robert Lowrance - Los Gatos CA, US
Eric Englhardt - Palo Alto CA, US
Dean C. Hruzek - Austin TX, US
Dave Silvetti - Morgan Hill CA, US
Michael Kuchar - Austin TX, US
Kirk Van Katwyk - Tracy CA, US
Van Hoskins - Round Rock TX, US
Vinay Shah - San Mateo CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

H01L 21/67

US Classification:

414805

Abstract:

A method and apparatus for processing substrates using a cluster tool that has an increased system throughput, increased system reliability, improved device yield performance, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robot assemblies that are configured in a parallel processing configuration and adapted to move in a vertical and a horizontal direction to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms.

US Patent:

7819079, Oct 26, 2010

Filed:

Sep 8, 2006

Appl. No.:

11/530297

Inventors:

Eric A. Englhardt - Palo Alto CA, US
Michael R. Rice - Pleasanton CA, US
Jeffrey C. Hudgens - San Francisco CA, US
Steve Hongkham - San Ramon CA, US
Jay D. Pinson - San Jose CA, US
Mohsen Salek - Saratoga CA, US
Charles Carlson - Cedar Park TX, US
William T Weaver - Austin TX, US
Helen R. Armer - Cupertino CA, US

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

B05C 13/02
H01L 21/677
C23C 14/00

US Classification:

118500, 118 50, 118503

Abstract:

The present invention generally provides an apparatus and method for processing substrates using a multi-chamber processing system (e. g. , a cluster tool) that is easily configurable, has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, and then certain portions of the photosensitive material are removed in a developing process completed in the cluster tool.