Charles L Carpenter

US Patent:

7880287, Feb 1, 2011

Filed:

Aug 7, 2009

Appl. No.:

12/537957

Inventors:

Bruno Samuel - Apopka FL, US
Charles Carpenter - Orlando FL, US
John Beall - Richardson TX, US
Justin Everman - Richardson TX, US
Benne Velsher - Plano TX, US

Assignee:

TriQuint Semiconductor, Inc. - Hillsboro OR

International Classification:

H01L 23/495

US Classification:

257692, 257737, 257E23031, 438123

Abstract:

Embodiments include but are not limited to apparatuses and systems including a package having stud bumps for die alignment. A package may include a package substrate, and a plurality of stud bumps coupled to the package substrate. The stud bumps may define a die region of the package substrate in which movement of a die disposed within the die region is restricted prior to attachment of the die to the package substrate, wherein the plurality of stud bumps comprise a profile that is less than a profile of the die when attached to the package substrate. Other embodiments may be described.

US Patent:

20170047232, Feb 16, 2017

Filed:

Aug 15, 2016

Appl. No.:

15/236586

Inventors:

- Greensboro NC, US
Frank Juskey - Apopka FL, US
Thomas Scott Morris - Lewisville NC, US
Charles E. Carpenter - Orlando FL, US
Robert Hartmann - Apopka FL, US

International Classification:

H01L 21/56
H01L 23/29
H01L 23/31
H01L 25/065
H01L 25/00

Abstract:

The present disclosure relates to a packaging process using a low pressure encapsulant. According to an exemplary process, an assembly including a substrate, a surface mounted device (SMD) mounted on the substrate, and a space between the SMD and the substrate is provided. The SMD has a sealed cavity biased towards the substrate. A sheet mold compound is laid over the SMD and the assembly is heated such that the sheet mold compound transitions to a liquid phase to form a molten mold compound. Next, the assembly is subjected to a vacuum that creates a negative atmosphere allowing the molten mold compound to flow towards the top surface of the substrate and about the SMD. The molten mold compound is then pressed towards the substrate at a low pressure (