Charles R Carpenter

Address:

713 Lk Highland Dr, Orlando, FL 32803

Phone:

4078985582

VIN:

1FMHK7F90CGA03709

Make:

FORD

Model:

EXPLORER

Year:

2012

Address:

3349 Fir Tree Ln, Erlanger, KY 41018

VIN:

1HGCM668X7A044434

Make:

HONDA

Model:

ACCORD

Year:

2007

US Patent:

6571638, Jun 3, 2003

Filed:

Jun 29, 2001

Appl. No.:

09/895873

Inventors:

Jacqueline Hines - Annapolis MD
Charles Carpenter - Orlando FL
Leland P. Solie - Apopka FL

Assignee:

Sawtek, Inc. - Orlando FL

International Classification:

G01L 1100

US Classification:

73702

Abstract:

A pressure and temperature sensor includes a sealed insulating package and an elastic, piezoelectric substrate deformably supported within the package. At least three surface-acoustic-wave resonators are affixed to a bottom of the substrate. A first and a second resonator are positioned in parallel relation along the substrate. A third resonator has a long axis nonparallel to the long axes of the first and the second resonator. The temperature coefficients of the first and second resonators are substantially equivalent; that of the third is different from those of the first and the second resonator, for permitting a temperature change to be sensed. Electrical connectors extend between the resonators to the outside of the package. A sensing system also includes an antenna for sending and receiving electromagnetic signals to and from the device.

US Patent:

6928718, Aug 16, 2005

Filed:

May 24, 2001

Appl. No.:

09/864918

Inventors:

Charles Carpenter - Orlando FL, US

Assignee:

Sawtekk, Inc. - Orlando FL

International Classification:

H04R031/00

US Classification:

29594, 296091, 29834, 29835, 156250, 156257, 156277, 310313, 310320, 310366, 333150, 333187, 333193, 333195, 333196

Abstract:

An assembly and method for array processing of hermetically sealed Surface Acoustic Wave (SAW) Devices employs a non-conductive material having an array of spaced cavities extending into the material for receiving a SAW die face down, in a flip-chip arrangement. Each cavity has a peripheral recess dimensioned to receive a lid for hermetically sealing the die within the cavity. Conductive paths are provided from the interior of the cavity to the surface of the array for providing an electrical contact with the SAW die. Individual SAW devices are then provided by cutting along separation lines between adjacent cavities after a plurality of die have been hermetically sealed within its cavity.

US Patent:

7230512, Jun 12, 2007

Filed:

Aug 19, 2004

Appl. No.:

10/921479

Inventors:

Charles Carpenter - Orlando FL, US
Jack Chocola - Lake Mary FL, US
Kevin K. Lin - Orlando FL, US
Phillip Welsh - Maitland FL, US

Assignee:

Triquint, Inc. - Orlando FL

International Classification:

H03H 9/00
H03H 9/10

US Classification:

333193, 333133

Abstract:

A SAW filter is fabricated at a wafer level for providing desirable temperature characteristics. The filter includes a piezoelectric substrate bonded to a carrier substrate, wherein the coefficient of thermal expansion of the carrier substrate is less than the coefficient of thermal expansion of the piezoelectric substrate. Interdigital transducers are formed on the piezoelectric substrate so as to form a SAW composite die structure. A cap substrate having a coefficient of thermal expansion similar to that of the carrier substrate is bonded to the SAW composite die structure for enclosing the interdigital transducers. Plated vias form signal pad interconnects to input and output pads of the interdigital transducer and a sealing pad formed on the surface of the piezoelectric substrate bonds the SAW composite die structure to the cap substrate.

US Patent:

7596849, Oct 6, 2009

Filed:

Jan 17, 2007

Appl. No.:

11/623884

Inventors:

Charles Carpenter - Orlando FL, US
George Grama - Sanford FL, US
Kevin K. Lin - Fremont CA, US

Assignee:

Triquint Semiconductor, Inc. - Orlando FL

International Classification:

H01S 4/00

US Classification:

295921, 29729, 29739, 29758, 29764, 29876, 310348, 310340, 310344, 439133, 439306, 439307, 439546, 439578

Abstract:

A wafer level package filter includes a device wafer having an acoustic wave device disposed on its surface, the acoustic wave device including at least an acoustic wave resonator associated with a piezoelectric substrate and a connecting pad. A capped substrate includes circuitry having inductors and capacitors. The capped substrate has a coefficient of thermal expansion significantly unequal to a coefficient of thermal expansion for the piezoelectric substrate. An adhesive bond connects the capped substrate to the device wafer for encapsulating the acoustic wave device within a cavity. A dielectric overcoat is deposited over a portion of the capped substrate, and a metallization layer extends over a portion of the dielectric layer connecting the capped substrate circuitry to a connecting pad of the acoustic wave device. Optionally, a bond connecting the capped substrate to the device wafer may provide an interlocking connection.

US Patent:

7880287, Feb 1, 2011

Filed:

Aug 7, 2009

Appl. No.:

12/537957

Inventors:

Bruno Samuel - Apopka FL, US
Charles Carpenter - Orlando FL, US
John Beall - Richardson TX, US
Justin Everman - Richardson TX, US
Benne Velsher - Plano TX, US

Assignee:

TriQuint Semiconductor, Inc. - Hillsboro OR

International Classification:

H01L 23/495

US Classification:

257692, 257737, 257E23031, 438123

Abstract:

Embodiments include but are not limited to apparatuses and systems including a package having stud bumps for die alignment. A package may include a package substrate, and a plurality of stud bumps coupled to the package substrate. The stud bumps may define a die region of the package substrate in which movement of a die disposed within the die region is restricted prior to attachment of the die to the package substrate, wherein the plurality of stud bumps comprise a profile that is less than a profile of the die when attached to the package substrate. Other embodiments may be described.

US Patent:

20120094418, Apr 19, 2012

Filed:

Oct 18, 2010

Appl. No.:

12/906689

Inventors:

George Grama - Sanford FL, US
Christophe Zinck - Orlando FL, US
Charles Carpenter - Orlando FL, US

International Classification:

H01L 21/50

US Classification:

438 51, 438118, 257E21499

Abstract:

A wafer level package is produced by forming a photo definable polymer into a frame structure around a device located on a device wafer while maintaining the polymer in a partially cured state. Additional polymer material is used form a cap structure on a carrier wafer. The cap structure is attached to the frame structure so as to place the device within a cavity, wherein sufficient pressure is applied to the cap structure to hold the frame structure via a bonding of the partially cured photo definable polymers. The bonding is characterized by adhesion strength greater than the adhesion strength securing the cap structure to the carrier wafer. The carrier wafer is separated from the device wafer with a force sufficient for separating the carrier wafer from the cap structure while the cap structure remains attached to the frame structure.

US Patent:

20130087379, Apr 11, 2013

Filed:

Oct 10, 2011

Appl. No.:

13/270152

Inventors:

George Grama - Sanford FL, US
Christophe Zinck - Grenoble, FR
Pierre-Alexandre Girard - Apopka FL, US
Charles E. Carpenter - Orlando FL, US

Assignee:

TRIQUINT SEMICONDUCTOR, INC. - Hillsboro OR

International Classification:

H05K 5/00
H05K 13/00

US Classification:

174546, 295921

Abstract:

Disclosed embodiments include a package having an electronic device disposed within a cavity formed by an enclosure that includes a sharp portion. The package may further include a photosensitive layer applied over the enclosure to provide a smooth portion that is adjacent to the sharp portion. Methods for manufacturing the package are also described. Other embodiments may be described and claimed.

US Patent:

20180109242, Apr 19, 2018

Filed:

Oct 16, 2017

Appl. No.:

15/785048

Inventors:

- Greensboro NC, US
Charles E. Carpenter - Orlando FL, US
Timothy Daniel - Orlando FL, US
Shogo Inoue - Longwood FL, US
Tom Moonlight - Altamonte Springs FL, US

International Classification:

H03H 9/64
H01L 41/29

Abstract:

A device including a piezoelectric substrate, an interdigital transducer (IDT), and an antireflective structure is disclosed herein. The piezoelectric substrate has a front-side surface and a smoothed back-side surface. The IDT is on the front-side surface of the piezoelectric substrate. The antireflective structure is over at least a portion of the smoothed back-side surface of the piezoelectric substrate. By having the antireflective structure on at least a portion of the smoothed back-side surface of the piezoelectric substrate, reflection of spurious bulk acoustic waves toward the front-side surface of the piezoelectric substrate can be reduced and/or eliminated to lessen interference with surface acoustic waves. The reduction and/or elimination of spurious bulk acoustic waves allows the device to forego conventional roughening of the back-side surface of the piezoelectric substrate, thereby reducing fractures at the back-side surface and allowing for singulation techniques capable of producing smaller die sizes.